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Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes
期刊论文
MICROSYSTEMS AND NANOENGINEERING, 2024, 卷号: 10, 期号: 1
作者:
Zhou, Cunkai
;
Tian, Ye
;
Li, Gen
;
Ye, Yifei
;
Gao, Lusha
Adobe PDF(3016Kb)
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收藏
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浏览/下载：561/92
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提交时间：2024/05/11
Animals
Brain
Brain computer interface
Chip scale packages
Electroencephalography
Electrophysiology
Integrated circuit manufacture
Neurophysiology
Platinum alloys
Probes
Signal processing
Three dimensional integrated circuits
Brain tissue
Electrophysiological recordings
Flexible device
Integrated circuit chips
Integrated device
Lightweight devices
Neural probes
Recording systems
Signal-processing
Via technologies
Demonstration of acousto-optical modulation based on a thin-film AlScN photonic platform
期刊论文
PHOTONICS RESEARCH, 2024, 卷号: 12, 期号: 6, 页码: 1138-1149
作者:
Bian, Kewei
;
Li, Zhenyu
;
Liu, Yushuai
;
Xu, Sumei
;
Zhao, Xingyan
Adobe PDF(2215Kb)
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浏览/下载：346/3
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提交时间：2024/06/21
Acoustic waves
Aluminum nitride
CMOS integrated circuits
Light modulation
MOS devices
Optical signal processing
Oxide semiconductors
Scandium
Scandium compounds
Thick films
Thin film circuits
Acousto-optic modulations
Acousto-optic modulator
Complementary metal-oxide-semiconductor technologies
Fabrication process
Microwave signal processing
Modulation technologies
On chips
Optical signal-processing
Piezoelectric property
Thin-films
Attention-Based EDA Tool Parameter Explorer: From Hybrid Parameters to Multi-QoR metrics
会议论文
IEEE/ACM PROCEEDINGS DESIGN, AUTOMATION AND TEST IN EUROPE (DATE), Valencia, Spain, 25-27 March 2024
作者:
Donger Luo
;
Qi Sun
;
Qi Xu
;
Tinghuan Chen
;
Geng H(耿浩)
Adobe PDF(931Kb)
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浏览/下载：369/3
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提交时间：2024/04/06
Electronic design automation
Integrated circuit design
Integrated circuits
Tuning
Circuit designers
Design Quality
Electronic design automation tools
Emerging technologies
Hybrid parameters
Parameters tuning
Quality of results
Tool parameter
Tunable parameter
Very large scale integration designs
Open-Source Differentiable Lithography Imaging Framework
会议论文
PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, San Jose, CA, United states, February 26, 2024 - February 29, 2024
作者:
Chen, Guojin
;
Geng, Hao
;
Yu, Bei
;
Pan, David Z.
Adobe PDF(873Kb)
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浏览/下载：244/1
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提交时间：2024/05/24
HTTP
Integrated circuits
Open source software
Photolithography
Program processors
Semiconductor device manufacture
Computational lithographies
Critical technologies
Differentiable programming
Electronic industries
Imaging modeling
Machine-learning
Open-source
Production cost
Semiconductor manufacturing
Wireless communications
The study of TSV-induced and strained silicon-enhanced stress in 3D-ICs
期刊论文
INTEGRATION, 2023, 卷号: 88, 页码: 196-202
作者:
Zhou, Jindong
;
Chen, Yuyang
;
Jing, Youliang
;
Zhou, Pingqiang
Adobe PDF(2005Kb)
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浏览/下载：403/3
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提交时间：2022/11/04
Carrier mobility
Integrated circuit manufacture
Silicon
Stress concentration
Thermal stress
Three dimensional integrated circuits
Timing circuits
Transistors
3D Structure
Finite element analyse
Planar transistors
Silicon Technologies
Silicon via
Strained-si
Strained-Silicon
Stresses distribution
Thermal stress distributions
Through silicon via
Progress in the Application of Bacteriorhodopsin in Biosensors
期刊论文
材料导报, 2021, 卷号: 35, 期号: 23, 页码: 23171-23182
作者:
Liu, Wenqing
;
Zhang, Tao
Adobe PDF(10269Kb)
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浏览/下载：276/0
|
提交时间：2022/02/13
Biological materials
Cytology
Energy conversion
Light sensitive materials
Microelectronics
Photoelectricity
Photosensitivity
Signal processing
Transducers
Bacteriorhodopsin
Chemical transducers
Electrical signal
Integrated technologies
Light driven
Light driven proton pump
Multiple disciplines
Photoelectric response
Proton pump
Sensitive elements
Towards 6G wireless communication networks: vision, enabling technologies, and new paradigm shifts
期刊论文
SCIENCE CHINA-INFORMATION SCIENCES, 2021, 卷号: 64, 期号: 1
作者:
You, Xiaohu
;
Wang, Cheng-Xiang
;
Huang, Jie
;
Gao, Xiqi
;
Zhang, Zaichen
Adobe PDF(6010Kb)
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收藏
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浏览/下载：2640/514
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提交时间：2020/12/30
6G
vision
network architecture
air interface and transmission technologies
space-air-ground-sea integrated network
all spectra
artificial intelligence
network security
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