Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes

doi:10.1038/s41378-024-00691-8

	Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes
	Zhou, Cunkai 1,2; Tian, Ye 2,3; Li, Gen 2,3; Ye, Yifei 2; Gao, Lusha 2; Li, Jiazhi 2; Liu, Ziwei 2; Su, Haoyang 3,4; Lu, Yunxiao 1,2; Li, Meng 3,4; Zhou, Zhitao 3,4; Wei, Xiaoling 3,4; Qin, Lunming 1; Tao, Tiger H.2,3,4,5,6,7,8,9,10 ; Sun, Liuyang 1,2,3,4
	2024-12
发表期刊	MICROSYSTEMS AND NANOENGINEERING (IF:7.3[JCR-2023],7.7[5-Year])
ISSN	2055-7434
EISSN	2055-7434
卷号	10 期号:1
发表状态	已发表
DOI	10.1038/s41378-024-00691-8
摘要	In implantable electrophysiological recording systems, the headstage typically comprises neural probes that interface with brain tissue and integrated circuit chips for signal processing. While advancements in MEMS and CMOS technology have significantly improved these components, their interconnection still relies on conventional printed circuit boards and sophisticated adapters. This conventional approach adds considerable weight and volume to the package, especially for high channel count systems. To address this issue, we developed a through-polymer via (TPV) method inspired by the through-silicon via (TSV) technique in advanced three-dimensional packaging. This innovation enables the vertical integration of flexible probes, amplifier chips, and PCBs, realizing a flexible, lightweight, and integrated device (FLID). The total weight of the FLIDis only 25% that of its conventional counterparts relying on adapters, which significantly increased the activity levels of animals wearing the FLIDs to nearly match the levels of control animals without implants. Furthermore, by incorporating a platinum-iridium alloy as the top layer material for electrical contact, the FLID realizes exceptional electrical performance, enabling in vivo measurements of both local field potentials and individual neuron action potentials. These findings showcase the potential of FLIDs in scaling up implantable neural recording systems and mark a significant advancement in the field of neurotechnology. © The Author(s) 2024.
关键词	Animals Brain Brain computer interface Chip scale packages Electroencephalography Electrophysiology Integrated circuit manufacture Neurophysiology Platinum alloys Probes Signal processing Three dimensional integrated circuits Brain tissue Electrophysiological recordings Flexible device Integrated circuit chips Integrated device Lightweight devices Neural probes Recording systems Signal-processing Via technologies
URL	查看原文
收录类别	EI ; SCI
语种	英语
资助项目	This work was partially supported by the National Key R D Program of China (Grant Nos. 2021ZD0201600, 2022YFF0706504, 2022ZD0209300, 2019YFA0905200, 2021YFC2501500, 2021YFF1200700, 2022ZD0212300), National Natural Science Foundation of China (Grant No. 6["2021ZD0201600","2022YFF0706504","2022ZD0209300","2019YFA0905200","2021YFC2501500","2021YFF1200700","2022ZD0212300"] ; National Key R & D Program of China[61974154] ; National Natural Science Foundation of China[ZDBS-LY-JSC024] ; Key Research Program of Frontier Sciences, CAS["JCYJ-SHFY-2022-01","JCYJ-SHFY-2022-0xx"] ; Shanghai Pilot Program for Basic Research-Chinese Academy of Science, the Shanghai Branch[2021SHZDZX] ; CAS Pioneer Hundred Talents Program["21PJ1415100","19PJ1410900"] ; Shanghai Pujiang Program["21JM0010200","21142200300"] ; Science and Technology Commission Foundation of Shanghai[22QA1410900] ; Shanghai Rising-Star Program[22YF1454700] ; Shanghai Sailing Program[20212ABC03W07] ; Innovative Research Team of High-level Local Universities in Shanghai, the Jiangxi Province 03 Special Project and 5 G Project[20201ZDE04013] ; Fund for Central Government in Guidance of Local Science and Technology Development["2021B0909060002","2021B0909050004"] ; Special Fund for Science and Technology Innovation Strategy of Guangdong Province[62305368]
WOS研究方向	Science & Technology - Other Topics ; Instruments & Instrumentation
WOS类目	Nanoscience & Nanotechnology ; Instruments & Instrumentation
WOS记录号	WOS:001206103600001
出版者	Springer Nature
EI入藏号	20241715966455
EI主题词	Printed circuit boards
EI分类号	461.1 Biomedical Engineering ; 461.6 Medicine and Pharmacology ; 547.1 Precious Metals ; 714.2 Semiconductor Devices and Integrated Circuits ; 716.1 Information Theory and Signal Processing ; 722.2 Computer Peripheral Equipment
原始文献类型	Journal article (JA)
引用统计	正在获取...
文献类型	期刊论文
条目标识符	https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/370138
专题	物质科学与技术学院物质科学与技术学院_特聘教授组_陶虎组
通讯作者	Qin, Lunming; Tao, Tiger H.; Sun, Liuyang
作者单位	1.College of Electronics and Information Engineering, Shanghai University of Electric Power, Shanghai, China 2.2020 X-Lab, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China 3.School of Graduate Study, University of Chinese Academy of Sciences, Beijing, China 4.State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China 5.Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, China 6.School of Physical Science and Technology, ShanghaiTech University, Shanghai, China 7.Center for Excellence in Brain Science and Intelligence Technology, Chinese Academy of Sciences, Shanghai, China 8.Neuroxess Co., Ltd. (Jiangxi), Jiangxi, Nanchang, China 9.Guangdong Institute of Intelligence Science and Technology, Hengqin, Guangdong, Zhuhai, China 10.Tianqiao and Chrissy Chen Institute for Translational Research, Shanghai, China
通讯作者单位	物质科学与技术学院
推荐引用方式 GB/T 7714	Zhou, Cunkai,Tian, Ye,Li, Gen,et al. Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes[J]. MICROSYSTEMS AND NANOENGINEERING,2024,10(1).
APA	Zhou, Cunkai.,Tian, Ye.,Li, Gen.,Ye, Yifei.,Gao, Lusha.,...&Sun, Liuyang.(2024).Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes.MICROSYSTEMS AND NANOENGINEERING,10(1).
MLA	Zhou, Cunkai,et al."Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes".MICROSYSTEMS AND NANOENGINEERING 10.1(2024).