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ShanghaiTech University Knowledge Management System
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Design of the first full-scale HYLITE, a charge integration pixel detector readout chip for XFEL
期刊论文
JOURNAL OF INSTRUMENTATION, 2024, 卷号: 19, 期号: 12
作者:
Li, M.
;
Wei, W.
;
Zhang, J.
;
Jiang, X.
;
Ju, X.
Adobe PDF(2504Kb)
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浏览/下载:150/7
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提交时间:2025/01/10
CMOS integrated circuits
Hadrons
Integrated circuit design
Linear accelerators
Particle beams
Particle detectors
Photoelectrons
Photons
Positive ions
Pulse repetition rate
Detector readout
Frame-rate
Front end
Front-end electronic for detector readout
Pixel detector
Pixelated detector and associated VLSI electronic
Pixelated detectors
Readout chips
VLSI electronics
X-ray detector
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes
期刊论文
MICROSYSTEMS AND NANOENGINEERING, 2024, 卷号: 10, 期号: 1
作者:
Zhou, Cunkai
;
Tian, Ye
;
Li, Gen
;
Ye, Yifei
;
Gao, Lusha
Adobe PDF(3016Kb)
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浏览/下载:538/81
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提交时间:2024/05/11
Animals
Brain
Brain computer interface
Chip scale packages
Electroencephalography
Electrophysiology
Integrated circuit manufacture
Neurophysiology
Platinum alloys
Probes
Signal processing
Three dimensional integrated circuits
Brain tissue
Electrophysiological recordings
Flexible device
Integrated circuit chips
Integrated device
Lightweight devices
Neural probes
Recording systems
Signal-processing
Via technologies
Design of a broadband Si3N4 waveguide amplifier based on a gain medium of ion-sliced titanium-doped sapphire
期刊论文
OPTICS LETTERS, 2024, 卷号: 49, 期号: 21, 页码: 6221-6224
作者:
Jiang, Liying
;
Shen, Shiji
;
Wei, Ning
;
Wang, Yan
;
He, Jiajing
Adobe PDF(3659Kb)
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浏览/下载:182/3
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提交时间:2024/11/29
Bonding
CMOS integrated circuits
Fiber optic sensors
Integrated circuit design
Silicon nitride
Silicon on sapphire technology
Silicon wafers
Titanium alloys
Wafer bonding
Costs reduction
Gain medium
Miniaturisation
On chips
On-chip integration
Sapphire amplifiers
Sapphire laser
Ti:sapphire
Titanium doped
Waveguide amplifiers
Optimized design and characterization of HYLITE, a charge-integration readout chip of XFEL
期刊论文
JOURNAL OF INSTRUMENTATION, 2024, 卷号: 19, 期号: 4
作者:
Li, M.
;
Wei, W.
;
Jiang, X.
;
Zhang, J.
;
Li, X.
Adobe PDF(2361Kb)
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收藏
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浏览/下载:176/0
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提交时间:2024/04/26
Electrons
Free electron lasers
Integrated circuit design
Particle beams
Readout systems
Signal to noise ratio
Specifications
VLSI circuits
X ray detectors
Data interfaces
Detector readout
Front end
Front-end electronic for detector readout
Optimized designs
Pixelated detector and associated VLSI electronic
Pixelated detectors
Readout chips
VLSI electronics
X-ray detector
Fast and Accurate NoC Latency Estimation for Application-Specific Traffics Via Machine Learning
期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II: EXPRESS BRIEFS, 2023, 卷号: 70, 期号: 9, 页码: 1-1
作者:
Yang Li
;
Pingqiang Zhou
Adobe PDF(3052Kb)
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浏览/下载:255/3
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提交时间:2023/04/21
Benchmarking
Feature extraction
Integrated circuit design
Learning systems
Network-on-chip
Application specific
Application-specific traffic
Benchmark testing
Features extraction
Latency estimation
Machine-learning
Network-on-chip
Networks on chips
Neural-networks
Transfer learning
Prototype characterization of a charge-integration pixel detector readout chip with in-pixel A/D conversion
期刊论文
JOURNAL OF INSTRUMENTATION, 2022, 卷号: 17, 期号: 1
作者:
Li, M.
;
Wei, W.
;
Jiang, X.
;
Cui, S.
;
Zhang, J.
Adobe PDF(12205Kb)
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收藏
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浏览/下载:265/2
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提交时间:2022/02/13
Analog to digital conversion
Electrons
Free electron lasers
Integrated circuit design
Readout systems
VLSI circuits
X ray detectors
Detector readout
Dynamic range
Frame-rate
Instrumentation for FEL
Pixelated detector and associated VLSI electronic
Pixelated detectors
Prototype chip
Readout chips
VLSI electronics
X-ray detector
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