×
验证码:
换一张
忘记密码?
记住我
×
统一认证登录
登录
中文版
|
English
上海科技大学知识管理系统
ShanghaiTech University Knowledge Management System
统一认证登录
登录
注册
ALL
ORCID
题名
作者
发表日期
关键词
文献类型
DOI
出处
存缴日期
收录类别
出版者
学习讨论厅
图片搜索
粘贴图片网址
首页
研究单元&专题
作者
文献类型
学科分类
知识图谱
知识整合
学习讨论厅
在结果中检索
研究单元&专题
信息科学与技术学院 [2]
物质科学与技术学院 [1]
生物医学工程学院 [1]
大科学中心 [1]
作者
周平强 [1]
陶虎 [1]
吴涛 [1]
周巾栋 [1]
景友亮 [1]
沈定刚 [1]
更多...
文献类型
期刊论文 [5]
发表日期
2025 [1]
2024 [2]
2023 [2]
出处
IEEE ELECT... [1]
IEEE JOURN... [1]
INTEGRATIO... [1]
LIGHT: SCI... [1]
MICROSYSTE... [1]
语种
英语 [5]
资助项目
CAS Pionee... [1]
Fund for C... [1]
Innovative... [1]
Key Resear... [1]
National K... [1]
National N... [1]
更多...
资助机构
收录类别
EI [5]
SCI [1]
SCOPUS [1]
×
知识图谱
KMS
反馈留言
浏览/检索结果:
共5条,第1-5条
帮助
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
提交时间升序
提交时间降序
题名升序
题名降序
作者升序
作者降序
WOS被引频次升序
WOS被引频次降序
发表日期升序
发表日期降序
期刊影响因子升序
期刊影响因子降序
AlScN Ferroelectric Diode Enabled CAM with 4F2 Cell Size and Low Thermal Budget (330 °C)
期刊论文
IEEE ELECTRON DEVICE LETTERS, 2025, 卷号: PP, 期号: 99
作者:
Wenxin Sun
;
Xiao Kou
;
Jiuren Zhou
;
Siying Zheng
;
Jiawei Li
Adobe PDF(1473Kb)
|
收藏
|
浏览/下载:70/1
|
提交时间:2025/02/12
Ferroelectric devices
Ferroelectric materials
PIN diodes
Three dimensional integrated circuits
Cell design
Cell-size
Content-addressable memory
Data-intensive application
Effective approaches
Fe-diode
Footprint
Low thermal budget
Thermal
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes
期刊论文
MICROSYSTEMS AND NANOENGINEERING, 2024, 卷号: 10, 期号: 1
作者:
Zhou, Cunkai
;
Tian, Ye
;
Li, Gen
;
Ye, Yifei
;
Gao, Lusha
Adobe PDF(3016Kb)
|
收藏
|
浏览/下载:534/79
|
提交时间:2024/05/11
Animals
Brain
Brain computer interface
Chip scale packages
Electroencephalography
Electrophysiology
Integrated circuit manufacture
Neurophysiology
Platinum alloys
Probes
Signal processing
Three dimensional integrated circuits
Brain tissue
Electrophysiological recordings
Flexible device
Integrated circuit chips
Integrated device
Lightweight devices
Neural probes
Recording systems
Signal-processing
Via technologies
A Unified Multi-Modality Fusion Framework for Deep Spatio-Temporal-Spectral Feature Learning in Resting-State fMRI Denoising
期刊论文
IEEE JOURNAL OF BIOMEDICAL AND HEALTH INFORMATICS, 2024, 卷号: PP, 期号: 99, 页码: 1-12
作者:
Lim, Minjoo
;
Heo, Keun-Soo
;
Kim, Jun-Mo
;
Kang, Bogyeong
;
Lin, Weili
Adobe PDF(4563Kb)
|
收藏
|
浏览/下载:278/4
|
提交时间:2024/04/12
Deep learning
Feature extraction
Integrated circuits
Neural networks
Noise abatement
Three dimensional displays
Time series analysis
Timing circuits
Wavelet transforms
Convolutional neural network
De-noising
Deep learning
Features extraction
Integrated circuit modeling
Kernel
Multi-modality fusion
Resting state
Resting-state fMRI
Stream
Three-dimensional display
Time-series analysis
Denoising
Attentional Ptycho-Tomography (APT) for three-dimensional nanoscale X-ray imaging with minimal data acquisition and computation time
期刊论文
LIGHT: SCIENCE AND APPLICATIONS, 2023, 卷号: 12, 期号: 1
作者:
Kang, Iksung
;
Wu, Ziling
;
Jiang, Yi
;
Yao, Yudong
;
Deng, Junjing
Adobe PDF(5874Kb)
|
收藏
|
浏览/下载:511/0
|
提交时间:2023/06/16
Backpropagation
Complex networks
Electromagnetic fields
Integrated circuits
Iterative methods
Nanotechnology
TomographyAcquisition time
Angular scanning
Complex fields
Computation time
Machine-learning
Nano scale
Simultaneous algebraic reconstruction technique
Three-dimensional object
Tomographic
Tomographic reconstruction
The study of TSV-induced and strained silicon-enhanced stress in 3D-ICs
期刊论文
INTEGRATION, 2023, 卷号: 88, 页码: 196-202
作者:
Zhou, Jindong
;
Chen, Yuyang
;
Jing, Youliang
;
Zhou, Pingqiang
Adobe PDF(2005Kb)
|
收藏
|
浏览/下载:383/3
|
提交时间:2022/11/04
Carrier mobility
Integrated circuit manufacture
Silicon
Stress concentration
Thermal stress
Three dimensional integrated circuits
Timing circuits
Transistors
3D Structure
Finite element analyse
Planar transistors
Silicon Technologies
Silicon via
Strained-si
Strained-Silicon
Stresses distribution
Thermal stress distributions
Through silicon via
首页
上一页
1
下一页
末页