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Compensation of Hot Carrier Degradation Enabled by Forward Back Bias in π-GAA-π MOSFET
2023-05
发表期刊IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY (IF:2.0[JCR-2023],2.3[5-Year])
ISSN2168-6734
EISSN2168-6734
卷号11页码:319-324
发表状态已发表
DOI10.1109/JEDS.2023.3278936
摘要

Forward back biasing (FBB) technique is considered as a potential solution for aging compensation in silicon on insulator (SOI) MOSFET. However, traditional SOI devices under FBB would suffer from extra off-state leakage current Ioff and undesirable static power consumption. In this work, we studied the hot carrier degradation and FBB compensation in π -GAA- π MOSFET. With the unique hybrid gate structure, the performance degradation is found to be less severe than pure π gate device; and moreover it can be partially recovered by FBB without the sacrifice of Ioff. The presence of π gates offer the back gate tunability that is not provided by pure GAA gate; while the GAA gate component can effectively prevent the impact of FBB from affecting the surface potential. Our findings in π -GAA- π hybrid gate MOSFETs would be beneficial for device reliability improvement. © 2013 IEEE.

关键词High electron mobility transistors III-V semiconductors Leakage currents MOSFET devices Silicon on insulator technology Aging compensation Back bias Biasing techniques Forward back biasing technique Hot carrier degradation MOS-FET MOSFETs Off-state leakage current Performances evaluation Silicon-on-insulator MOSFETs
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收录类别EI
语种英语
出版者Institute of Electrical and Electronics Engineers Inc.
EI入藏号20232314197215
EI主题词Gallium arsenide
EI分类号701.1 Electricity: Basic Concepts and Phenomena ; 712.1 Semiconducting Materials ; 714.2 Semiconductor Devices and Integrated Circuits ; 804 Chemical Products Generally
原始文献类型Journal article (JA)
来源库IEEE
文献类型期刊论文
条目标识符https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/312332
专题信息科学与技术学院
信息科学与技术学院_公共科研平台_机电能源与电子器件科研平台
信息科学与技术学院_PI研究组_吴涛组
信息科学与技术学院_硕士生
信息科学与技术学院_博士生
信息科学与技术学院_PI研究组_杨雨梦组
作者单位
1.Shanghai Engineering Research Center of Energy Efficient and Custom AI IC, School of Information Science and Technology, ShanghaiTech University, Shanghai, China
2.State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China
3.i-Lab, Key Laboratory of Multifunctional Nanomaterials and Smart Systems, Suzhou Institute of NanoTech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, China
4.Shanghai Simchip Technology Group Company Ltd., Shanghai, China
第一作者单位信息科学与技术学院
第一作者的第一单位信息科学与技术学院
推荐引用方式
GB/T 7714
Yijun Qian,Qiang Liu,Jialun Yao,et al. Compensation of Hot Carrier Degradation Enabled by Forward Back Bias in π-GAA-π MOSFET[J]. IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY,2023,11:319-324.
APA Yijun Qian.,Qiang Liu.,Jialun Yao.,Xiaowei Wang.,Amit Kumar Shukla.,...&Yumeng Yang.(2023).Compensation of Hot Carrier Degradation Enabled by Forward Back Bias in π-GAA-π MOSFET.IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY,11,319-324.
MLA Yijun Qian,et al."Compensation of Hot Carrier Degradation Enabled by Forward Back Bias in π-GAA-π MOSFET".IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY 11(2023):319-324.
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