Improved thermal comfort modeling for smart buildings: A data analytics study

doi:10.1016/j.ijepes.2018.06.026

	Improved thermal comfort modeling for smart buildings: A data analytics study
	Zhang, Wei 1; Liu, Fang 1; Fan, Rui2
	2018-12
发表期刊	INTERNATIONAL JOURNAL OF ELECTRICAL POWER & ENERGY SYSTEMS
ISSN	0142-0615
卷号	103 页码:634-643
发表状态	已发表
DOI	10.1016/j.ijepes.2018.06.026
摘要	Thermal comfort is a key consideration in the design and modeling of buildings and is one of the main steps to achieving smart building control and operation. Existing solutions model thermal comfort based on factors such as indoor temperature. However, these factors are not directly controllable by building operations, and instead are a by-product of complex interactions between controllable parameters such as air conditioning setpoint and other environmental conditions. In this paper, we use machine learning (ML) to bridge the gap between controllable building parameters and thermal comfort, by conducting an extensive study on the efficacy of different ML techniques for modeling comfort levels. We show that neural networks are especially effective, and achieve 98.7% accuracy on average. We also show these networks can lead to linear models where thermal comfort score scales linearly with the HVAC setpoint, and that the linear models can be used to quickly and accurately find the optimal setpoint for the desired comfort level.
关键词	Thermal comfort Machine learning Data analytics Smart buildings Smart city Smart grid
收录类别	SCI ; SCIE ; EI
语种	英语
WOS研究方向	Engineering
WOS类目	Engineering, Electrical & Electronic
WOS记录号	WOS:000439746200060
出版者	ELSEVIER SCI LTD
EI入藏号	20182605358845
EI主题词	Air conditioning ; Artificial intelligence ; Intelligent buildings ; Learning systems ; Smart city ; Thermal comfort
EI分类号	Buildings and Towers:402 ; Space Heating, Ventilation and Air Conditioning:643 ; Air Conditioning:643.3 ; Artificial Intelligence:723.4
WOS关键词	MANAGEMENT ; INDOOR
原始文献类型	Article
引用统计
文献类型	期刊论文
条目标识符	https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/27400
专题	信息科学与技术学院_PI研究组_范睿组
通讯作者	Liu, Fang
作者单位	1.Nanyang Technol Univ, Sch Comp Sci & Engn, Singapore, Singapore 2.ShanghaiTech Univ, Sch Informat Sci & Technol, Shanghai, Peoples R China
推荐引用方式 GB/T 7714	Zhang, Wei,Liu, Fang,Fan, Rui. Improved thermal comfort modeling for smart buildings: A data analytics study[J]. INTERNATIONAL JOURNAL OF ELECTRICAL POWER & ENERGY SYSTEMS,2018,103:634-643.
APA	Zhang, Wei,Liu, Fang,&Fan, Rui.(2018).Improved thermal comfort modeling for smart buildings: A data analytics study.INTERNATIONAL JOURNAL OF ELECTRICAL POWER & ENERGY SYSTEMS,103,634-643.
MLA	Zhang, Wei,et al."Improved thermal comfort modeling for smart buildings: A data analytics study".INTERNATIONAL JOURNAL OF ELECTRICAL POWER & ENERGY SYSTEMS 103(2018):634-643.