Inspection of Defect Under Thick Insulation Based on Magnetic Imaging With TMR Array Sensors

doi:10.1109/TMAG.2021.3138587

	Inspection of Defect Under Thick Insulation Based on Magnetic Imaging With TMR Array Sensors
	Yang Wang1,2,3 ; Yong Nie 4; Pan Qi 4; Na Zhang1 ; Chaofeng Ye1
	2022-03-01
发表期刊	IEEE TRANSACTIONS ON MAGNETICS (IF:2.1[JCR-2023],2.0[5-Year])
ISSN	1941-0069
卷号	58 期号:3
发表状态	已发表
DOI	10.1109/TMAG.2021.3138587
摘要	A lot of industrial structures are covered by insulation. Defects under insulation (DUI) frequently distress the structure maintenance and may lead to serious safety concerns. In this article, a probe with tunneling magnetoresistance (TMR) array sensors is proposed to inspect defects under thick insulation. The probe contains 64 TMR sensors with the size of each sensor length $\times $ width = 0.45 mm $\times0.45$ mm, which can generate a magnetic field image with high spatial resolution. Excitation current with extremely low frequency (in the order of a few hundred Hertz) is utilized for inspection of defects with large liftoff distances. In this low-frequency range, the TMR sensors have much better sensitivity than conventional induction coils. A data processing method based on discrete wavelet transform (DWT) is utilized to reduce noise and highlight defect indication. Experimental results demonstrate that the probe is capable of detecting a machined rectangular defect with dimensions of 6 mm (length), 3 mm (width), and 1 mm (depth) under 10 mm thick insulation. The minimum dimensions of the machined defect under 20 mm insulation that can be detected by the probe are 9 mm (length), 3 mm (width), and 1 mm (depth). As a comparison, for a commercial pulsed eddy current probe (PECA-HR-SM), the length of minimum detectable detect is 19 mm under 18 mm thick insulation. If the thickness of the insulation is 30 mm, a machined rectangular defect with dimensions 21 mm (length), 3 mm (width), and 7 mm (depth) can be detected by the proposed probe. The experimental results demonstrate that the proposed probe is a promising alternation with excellent sensitivity for inspection of defects with large liftoff distances.
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收录类别	SCI ; SCIE ; EI
来源库	IEEE
引用统计	正在获取...
文献类型	期刊论文
条目标识符	https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/159568
专题	信息科学与技术学院信息科学与技术学院_PI研究组_叶朝锋组信息科学与技术学院_博士生信息科学与技术学院_PI研究组_汪阳组
作者单位	1.School of Information Science and Technology, ShanghaiTech University, Shanghai, China 2.Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China 3.University of Chinese Academy of Sciences, Beijing, China 4.China Nuclear Power Operation Technology Corporation, Ltd., Wuhan, China
第一作者单位	信息科学与技术学院
第一作者的第一单位	信息科学与技术学院
推荐引用方式 GB/T 7714	Yang Wang,Yong Nie,Pan Qi,et al. Inspection of Defect Under Thick Insulation Based on Magnetic Imaging With TMR Array Sensors[J]. IEEE TRANSACTIONS ON MAGNETICS,2022,58(3).
APA	Yang Wang,Yong Nie,Pan Qi,Na Zhang,&Chaofeng Ye.(2022).Inspection of Defect Under Thick Insulation Based on Magnetic Imaging With TMR Array Sensors.IEEE TRANSACTIONS ON MAGNETICS,58(3).
MLA	Yang Wang,et al."Inspection of Defect Under Thick Insulation Based on Magnetic Imaging With TMR Array Sensors".IEEE TRANSACTIONS ON MAGNETICS 58.3(2022).