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A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, TRANSACTIONS OF THE ASME, 2025, 卷号: 147, 期号: 1
作者:  Chu, Liu;  Shi, Jiajia;  De Cursi, Eduardo Souza
收藏  |  浏览/下载:436/0  |  提交时间:2024/07/05
Ultrathin, Transferred Layers of Silicon Oxynitrides as Tunable Biofluid Barriers for Bioresorbable Electronic Systems 期刊论文
ADVANCED MATERIALS, 2024, 卷号: 36, 期号: 15
作者:  Hu, Ziying;  Zhao, Jie;  Guo, Hexia;  Li, Rui;  Wu, Mingzheng
Adobe PDF(7589Kb)  |  收藏  |  浏览/下载:337/0  |  提交时间:2024/02/23
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