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Piezoelectric Micromachined Ultrasonic Transducers with Micro-Hole Inter-Etch and Sealing Process on (111) Silicon Wafer 期刊论文
MICROMACHINES, 2024, 卷号: 15, 期号: 4
作者:  Wang, Yunhao;  Wu, Sheng;  Wang, Wenjing;  Wu, Tao;  Li, Xinxin
Adobe PDF(5053Kb)  |  收藏  |  浏览/下载:418/50  |  提交时间:2024/05/11
300 mm integration of a scalable phase change material spacer by inductively coupled plasma etching 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2023, 卷号: 164
作者:  Fang, Wencheng;  Zheng, Jia;  Zhang, Jiarui;  Li, Chengxing;  Wang, Ruobing
Adobe PDF(9718Kb)  |  收藏  |  浏览/下载:308/1  |  提交时间:2023/07/07
PMUT Structure Design with a Scar-Free Minimally Invasive Surgery Process on (111) Silicon Wafer 会议论文
2022 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IEEE IUS), null,Venice,ITALY, OCT 10-13, 2022
作者:  Wu, Sheng;  Li, Wei;  Shao, Shuai;  Yang, Heng;  Wu, Tao
Adobe PDF(372Kb)  |  收藏  |  浏览/下载:516/4  |  提交时间:2023/02/10
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