Subsystem under 3D-Storage Class Memory on a chip

doi:10.1016/j.compeleceng.2019.01.009

	Subsystem under 3D-Storage Class Memory on a chip
	Guo, Jipeng 1,2; Wang, Haibo 1,2; Jing, Weiliang 3; Li, Haixin1,2,4 ; Du, Yuan 1,2; Song, Zhitang 1; Chen, Bomy 1,3
	2019-03
发表期刊	COMPUTERS & ELECTRICAL ENGINEERING (IF:4.0[JCR-2023],3.8[5-Year])
ISSN	0045-7906
卷号	74 页码:47-58
发表状态	已发表
DOI	10.1016/j.compeleceng.2019.01.009
摘要	In this paper, we propose a subsystem architecture under 3D-Storage Class Memory (3D-SCM), termed SuS, to solve the memory and power wall problems. Placing the processing unit under the 3D-SCM achieves high performance. We evaluate SuS using gem5 and the GPGPU-Sim simulator. The simulation results for the central processing unit (CPU)-based SuS architecture reveal a 100% performance improvement and a 73% energy reduction compared to the CPU architecture using dual in-line memory modules and a 4% performance improvement with a 27% energy reduction compared to the CPU architecture using hybrid memory cube. Moreover, the graphics processing unit (GPU)-based SuS architecture simulation results on the neural network benchmark demonstrate performance improvements of 17% and 7% compared to GPU architectures with graphics double data rate series memory and high bandwidth memory, respectively. (C) 2019 Elsevier Ltd. All rights reserved.
关键词	3D-Xpoint phase change memory Subsystem under 3D-SCM nvSAN DaysRAM Artificial intelligence Near-data processing
收录类别	EI ; SCIE ; SCI
语种	英语
资助项目	Science and Technology Council of Shanghai[17DZ2291300]
WOS研究方向	Computer Science ; Engineering
WOS类目	Computer Science, Hardware & Architecture ; Computer Science, Interdisciplinary Applications ; Engineering, Electrical & Electronic
WOS记录号	WOS:000474672200004
出版者	PERGAMON-ELSEVIER SCIENCE LTD
EI入藏号	20190406402067
EI主题词	Artificial intelligence ; Benchmarking ; Computer graphics ; Computer graphics equipment ; Data handling ; Memory architecture ; Network architecture ; Phase change memory ; Program processors
EI分类号	Computer Systems and Equipment:722 ; Computer Software, Data Handling and Applications:723
原始文献类型	Article
引用统计	正在获取...
文献类型	期刊论文
条目标识符	https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/45585
专题	信息科学与技术学院物质科学与技术学院_硕士生
通讯作者	Guo, Jipeng; Jing, Weiliang
作者单位	1.Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Funct Mat Informat, Shanghai 200050, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100049, Peoples R China 3.Shanghai Xinchu Integrated Circuit Inc, Shanghai 200122, Peoples R China 4.ShanghaiTech Univ, Sch Informat Sci & Technol, Shanghai 201210, Peoples R China
推荐引用方式 GB/T 7714	Guo, Jipeng,Wang, Haibo,Jing, Weiliang,et al. Subsystem under 3D-Storage Class Memory on a chip[J]. COMPUTERS & ELECTRICAL ENGINEERING,2019,74:47-58.
APA	Guo, Jipeng.,Wang, Haibo.,Jing, Weiliang.,Li, Haixin.,Du, Yuan.,...&Chen, Bomy.(2019).Subsystem under 3D-Storage Class Memory on a chip.COMPUTERS & ELECTRICAL ENGINEERING,74,47-58.
MLA	Guo, Jipeng,et al."Subsystem under 3D-Storage Class Memory on a chip".COMPUTERS & ELECTRICAL ENGINEERING 74(2019):47-58.