Resolution Enhanced Array ECT Probe for Small Defects Inspection
2023-02
Source PublicationSENSORS
ISSN1424-8220
EISSN1424-8220
Volume23Issue:4
Status已发表
DOI10.3390/s23042070
AbstractIt is a continual and challenging problem to detect small defects in metallic structures for array eddy current testing (ECT) probes, which require the probe to have ultra-high resolution and sensitivity. However, the spatial resolution of an ECT array probe is limited by the size of the induction coils. Even if it is possible to increase the spatial resolution by using smaller coils, the sensitivity of the sensor also decreases. To obtain finer spatial resolution without sacrificing sensitivity, this paper proposes a resolution enhanced ECT array probe with four rows of coils attached to a flexible printed circuit board (FPCB). The distance between each two adjacent coils in a row is 2 mm and the position of each row is offset by 0.5 mm along the horizontal direction related to its prior row. The outputs of the four rows are aligned and interpolated in a line, and in this way the image resolution of the probe is increased to 0.5 mm. The probe is configured to operate with the differential setting, namely two differential coils operate simultaneously at each time. The currents in the two coils can be controlled to have the same flowing direction or opposite flowing direction, resulting in different distributions of the induced eddy current and two sets of output images. A patch-image model and an image fusion method based on discrete wavelet transforms are employed to suppress the noise and highlight the defects’ indications. Experimental results show that small defects with dimensions as small as length × width × depth = 1 mm × 0.1 mm × 0.3 mm on a 304 stainless-steel sample can be detected from the fused image, demonstrating that the probe has super sensitivity for small defects inspection. © 2023 by the authors.
KeywordDefects Discrete wavelet transforms Eddy current testing Flexible electronics Image fusion Image resolution Inspection Printed circuit boards Array probe Defects inspections Eddy current testing Eddy-current testing Flexible sensor Metallic structures Non destructive testing Small defect inspection Spatial resolution Ultra-high-sensitivity
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Indexed ByEI ; SCOPUS ; SCI
Language英语
WOS Research AreaChemistry ; Engineering ; Instruments & Instrumentation
WOS SubjectChemistry, Analytical ; Engineering, Electrical & Electronic ; Instruments & Instrumentation
WOS IDWOS:000941813300001
PublisherMDPI
EI Accession Number20231013669299
EI KeywordsProbes
EI Classification Number715 Electronic Equipment, General Purpose and Industrial ; 723.2 Data Processing and Image Processing ; 921.3 Mathematical Transformations ; 951 Materials Science
Original Document TypeJournal article (JA)
Citation statistics
Document Type期刊论文
Identifierhttps://kms.shanghaitech.edu.cn/handle/2MSLDSTB/284259
Collection信息科学与技术学院
信息科学与技术学院_PI研究组_叶朝锋组
信息科学与技术学院_硕士生
信息科学与技术学院_博士生
Corresponding AuthorYe, Chaofeng
Affiliation
ShanghaiTech Univ, Sch Informat Sci & Technol, Shanghai 201210, Peoples R China
First Author AffilicationSchool of Information Science and Technology
Corresponding Author AffilicationSchool of Information Science and Technology
First Signature AffilicationSchool of Information Science and Technology
Recommended Citation
GB/T 7714
Long, Cai,Zhang, Na,Tao, Xinchen,et al. Resolution Enhanced Array ECT Probe for Small Defects Inspection[J]. SENSORS,2023,23(4).
APA Long, Cai,Zhang, Na,Tao, Xinchen,Tao, Yu,&Ye, Chaofeng.(2023).Resolution Enhanced Array ECT Probe for Small Defects Inspection.SENSORS,23(4).
MLA Long, Cai,et al."Resolution Enhanced Array ECT Probe for Small Defects Inspection".SENSORS 23.4(2023).
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