Resolution Enhanced Array ECT Probe for Small Defects Inspection

doi:10.3390/s23042070

	Resolution Enhanced Array ECT Probe for Small Defects Inspection
	Long, Cai; Zhang, Na; Tao, Xinchen; Tao, Yu; Ye, Chaofeng
	2023-02
发表期刊	SENSORS (IF:3.4[JCR-2023],3.7[5-Year])
ISSN	1424-8220
EISSN	1424-8220
卷号	23 期号:4
发表状态	已发表
DOI	10.3390/s23042070
摘要	It is a continual and challenging problem to detect small defects in metallic structures for array eddy current testing (ECT) probes, which require the probe to have ultra-high resolution and sensitivity. However, the spatial resolution of an ECT array probe is limited by the size of the induction coils. Even if it is possible to increase the spatial resolution by using smaller coils, the sensitivity of the sensor also decreases. To obtain finer spatial resolution without sacrificing sensitivity, this paper proposes a resolution enhanced ECT array probe with four rows of coils attached to a flexible printed circuit board (FPCB). The distance between each two adjacent coils in a row is 2 mm and the position of each row is offset by 0.5 mm along the horizontal direction related to its prior row. The outputs of the four rows are aligned and interpolated in a line, and in this way the image resolution of the probe is increased to 0.5 mm. The probe is configured to operate with the differential setting, namely two differential coils operate simultaneously at each time. The currents in the two coils can be controlled to have the same flowing direction or opposite flowing direction, resulting in different distributions of the induced eddy current and two sets of output images. A patch-image model and an image fusion method based on discrete wavelet transforms are employed to suppress the noise and highlight the defects’ indications. Experimental results show that small defects with dimensions as small as length × width × depth = 1 mm × 0.1 mm × 0.3 mm on a 304 stainless-steel sample can be detected from the fused image, demonstrating that the probe has super sensitivity for small defects inspection. © 2023 by the authors.
关键词	Defects Discrete wavelet transforms Eddy current testing Flexible electronics Image fusion Image resolution Inspection Printed circuit boards Array probe Defects inspections Eddy current testing Eddy-current testing Flexible sensor Metallic structures Non destructive testing Small defect inspection Spatial resolution Ultra-high-sensitivity
URL	查看原文
收录类别	EI ; SCOPUS ; SCI
语种	英语
WOS研究方向	Chemistry ; Engineering ; Instruments & Instrumentation
WOS类目	Chemistry, Analytical ; Engineering, Electrical & Electronic ; Instruments & Instrumentation
WOS记录号	WOS:000941813300001
出版者	MDPI
EI入藏号	20231013669299
EI主题词	Probes
EI分类号	715 Electronic Equipment, General Purpose and Industrial ; 723.2 Data Processing and Image Processing ; 921.3 Mathematical Transformations ; 951 Materials Science
原始文献类型	Journal article (JA)
引用统计	正在获取...
文献类型	期刊论文
条目标识符	https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/284259
专题	信息科学与技术学院信息科学与技术学院_PI研究组_叶朝锋组信息科学与技术学院_硕士生信息科学与技术学院_博士生
通讯作者	Ye, Chaofeng
作者单位	ShanghaiTech Univ, Sch Informat Sci & Technol, Shanghai 201210, Peoples R China
第一作者单位	信息科学与技术学院
通讯作者单位	信息科学与技术学院
第一作者的第一单位	信息科学与技术学院
推荐引用方式 GB/T 7714	Long, Cai,Zhang, Na,Tao, Xinchen,et al. Resolution Enhanced Array ECT Probe for Small Defects Inspection[J]. SENSORS,2023,23(4).
APA	Long, Cai,Zhang, Na,Tao, Xinchen,Tao, Yu,&Ye, Chaofeng.(2023).Resolution Enhanced Array ECT Probe for Small Defects Inspection.SENSORS,23(4).
MLA	Long, Cai,et al."Resolution Enhanced Array ECT Probe for Small Defects Inspection".SENSORS 23.4(2023).