ShanghaiTech University Knowledge Management System
| Resolution Enhanced Array ECT Probe for Small Defects Inspection | |
| 2023-02 | |
| Source Publication | SENSORS
 |
| ISSN | 1424-8220 |
| EISSN | 1424-8220 |
| Volume | 23Issue:4 |
| Status | 已发表 |
| DOI | 10.3390/s23042070 |
| Abstract | It is a continual and challenging problem to detect small defects in metallic structures for array eddy current testing (ECT) probes, which require the probe to have ultra-high resolution and sensitivity. However, the spatial resolution of an ECT array probe is limited by the size of the induction coils. Even if it is possible to increase the spatial resolution by using smaller coils, the sensitivity of the sensor also decreases. To obtain finer spatial resolution without sacrificing sensitivity, this paper proposes a resolution enhanced ECT array probe with four rows of coils attached to a flexible printed circuit board (FPCB). The distance between each two adjacent coils in a row is 2 mm and the position of each row is offset by 0.5 mm along the horizontal direction related to its prior row. The outputs of the four rows are aligned and interpolated in a line, and in this way the image resolution of the probe is increased to 0.5 mm. The probe is configured to operate with the differential setting, namely two differential coils operate simultaneously at each time. The currents in the two coils can be controlled to have the same flowing direction or opposite flowing direction, resulting in different distributions of the induced eddy current and two sets of output images. A patch-image model and an image fusion method based on discrete wavelet transforms are employed to suppress the noise and highlight the defects’ indications. Experimental results show that small defects with dimensions as small as length × width × depth = 1 mm × 0.1 mm × 0.3 mm on a 304 stainless-steel sample can be detected from the fused image, demonstrating that the probe has super sensitivity for small defects inspection. © 2023 by the authors. |
| Keyword | Defects Discrete wavelet transforms Eddy current testing Flexible electronics Image fusion Image resolution Inspection Printed circuit boards Array probe Defects inspections Eddy current testing Eddy-current testing Flexible sensor Metallic structures Non destructive testing Small defect inspection Spatial resolution Ultra-high-sensitivity |
| URL | 查看原文 |
| Indexed By | EI ; SCOPUS ; SCI |
| Language | 英语 |
| WOS Research Area | Chemistry ; Engineering ; Instruments & Instrumentation |
| WOS Subject | Chemistry, Analytical ; Engineering, Electrical & Electronic ; Instruments & Instrumentation |
| WOS ID | WOS:000941813300001 |
| Publisher | MDPI |
| EI Accession Number | 20231013669299 |
| EI Keywords | Probes |
| EI Classification Number | 715 Electronic Equipment, General Purpose and Industrial ; 723.2 Data Processing and Image Processing ; 921.3 Mathematical Transformations ; 951 Materials Science |
| Original Document Type | Journal article (JA) |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/284259 |
| Collection | 信息科学与技术学院 信息科学与技术学院_PI研究组_叶朝锋组 信息科学与技术学院_硕士生 信息科学与技术学院_博士生 |
| Corresponding Author | Ye, Chaofeng |
| Affiliation | ShanghaiTech Univ, Sch Informat Sci & Technol, Shanghai 201210, Peoples R China |
| First Author Affilication | School of Information Science and Technology |
| Corresponding Author Affilication | School of Information Science and Technology |
| First Signature Affilication | School of Information Science and Technology |
| Recommended Citation GB/T 7714 | Long, Cai,Zhang, Na,Tao, Xinchen,et al. Resolution Enhanced Array ECT Probe for Small Defects Inspection[J]. SENSORS,2023,23(4). |
| APA | Long, Cai,Zhang, Na,Tao, Xinchen,Tao, Yu,&Ye, Chaofeng.(2023).Resolution Enhanced Array ECT Probe for Small Defects Inspection.SENSORS,23(4). |
| MLA | Long, Cai,et al."Resolution Enhanced Array ECT Probe for Small Defects Inspection".SENSORS 23.4(2023). |
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