Electroless deposition of copper alloy in the PEG additive

doi:10.1109/ICEPT.2015.7236832

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	Electroless deposition of copper alloy in the PEG additive
	Zhang, Wenjing1 ; Wang, Ning 2; Hang, Tao 2; Li, Ming 2
	2015
会议录名称	2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY
发表状态	已发表
DOI	10.1109/ICEPT.2015.7236832
摘要	In this paper, Cu alloy with rough micro-scale morphology was successfully electroless plated with the help of polyethylene glycol (PEG) additive. The morphology was observed by SEM and electrochemical mechanism of micro-nano-structured Cu alloy formation was analyzed using linear sweep voltammetry. Results show that increase in PEG concentration could inhibit the anodic and cathodic reaction and the growth of secondary structure on the cone surface. The different type of crystallization modifier could result in different surface morphology. And the adsorption effect of PEG increases with the molecular weight.
关键词	Copper alloy Electroless plating micro/nano structure PEG
出版地	345 E 47TH ST, NEW YORK, NY 10017 USA
会议地点	Changsha
会议日期	11-14 Aug. 2015
URL	查看原文
收录类别	CPCI ; EI
语种	英语
WOS研究方向	Engineering
WOS类目	Engineering, Electrical & Electronic
WOS记录号	WOS:000380377000302
出版者	IEEE
EI入藏号	20160701931511
EI主题词	Cones ; Copper ; Electroless plating ; Electronics packaging ; Morphology ; Polyethylene glycols
EI分类号	Electroless Plating:539.3.2 ; Copper:544.1 ; Copper Alloys:544.2 ; Organic Polymers:815.1.1 ; Materials Science:951
WOS关键词	PLATING TECHNOLOGY ; IMPROVEMENT ; ADHESION
原始文献类型	Proceedings Paper
引用统计	正在获取...
文献类型	会议论文
条目标识符	https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/2285
专题	物质科学与技术学院_公共教学平台_物理基础与专业实验教学中心
通讯作者	Zhang, Wenjing
作者单位	1.Shanghai Tech Univ, Sch Phys Sci & Technol, Shanghai, Peoples R China 2.Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Shanghai, Peoples R China
第一作者单位	物质科学与技术学院
通讯作者单位	物质科学与技术学院
第一作者的第一单位	物质科学与技术学院
推荐引用方式 GB/T 7714	Zhang, Wenjing,Wang, Ning,Hang, Tao,et al. Electroless deposition of copper alloy in the PEG additive[C]. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE,2015.