Fabrication of high-performance electromagnetic wave absorbing SiC composites reinforced by 3D printed carbon-based nanonetwork with Fe3O4 nanoparticles
2022-07
发表期刊ADDITIVE MANUFACTURING (IF:10.3[JCR-2023],12.4[5-Year])
ISSN2214-8604
EISSN2214-8604
卷号55
发表状态已发表
DOI10.1016/j.addma.2022.102855
摘要

Here a free-standing and high-performance electromagnetic wave (EMW) absorber is developed by the in-situ growth of SiC into 3D-printed carbon-based scaffolds by chemical vapor deposition (CVD). The porous and interconnected network of graphene nanoplatelets (GNPs)/carbon nanotubes (CNTs) is oriented constructed and Fe-based magnetic nanoparticles are uniformly dispersed. Accompanied by the optimization of SiC to the mechanical properties of composites, the impedance matching behavior and attenuation capacity can be regulated by reducing the electrical conductivity of the carbon-based nanonetwork. Therefore, the as-prepared composites present a minimum reflection loss (RL) value of −48.7 dB, and a 2 mm-thick absorber whose reflection loss is better than −10 dB in 11.5–15.8 GHz is also achieved. Besides, the absorbing properties of the material remained consistent after annealing at 400 °C for 4 h. The controllable fabrication of composites shows appropriately promising potential as absorbers in a high-temperature environment with considerable EMW absorption performance. © 2022 Elsevier B.V.

关键词3D printers Carbon nanotubes Chemical vapor deposition Circular waveguides Electromagnetic waves Fabrication Impedance matching (electric) Magnetite Nanoparticles Scaffolds Silicon Silicon carbide 3-D printing 3D-printing Carbon-based Carbon-based nanonetwork Electromagnetic wave absorber Free standings Impedance matchings Nano-networks Performance Reflection loss
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收录类别SCI ; SCIE ; EI
语种英语
资助项目National Natural Science Foundation of China[51772310] ; Chinese Academy of Sciences Key Research Program of Frontier Sciences[QYZDY-SSWJSC031] ; Key Deployment Projects of the Chinese Academy of Sciences[ZDRW-CN-2019-01] ; Shanghai Sailing Program[21YF1454600]
WOS研究方向Engineering ; Materials Science
WOS类目Engineering, Manufacturing ; Materials Science, Multidisciplinary
WOS记录号WOS:000832875400004
出版者Elsevier B.V.
EI入藏号20221912071680
EI主题词Electromagnetic wave absorption
EI分类号405.1 Construction Equipment ; 549.3 Nonferrous Metals and Alloys excluding Alkali and Alkaline Earth Metals ; 711 Electromagnetic Waves ; 714.3 Waveguides ; 745.1.1 Printing Equipment ; 761 Nanotechnology ; 802.2 Chemical Reactions ; 804.2 Inorganic Compounds ; 933 Solid State Physics ; 933.1 Crystalline Solids
原始文献类型Journal article (JA)
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文献类型期刊论文
条目标识符https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/180930
专题物质科学与技术学院_硕士生
物质科学与技术学院_特聘教授组_宋力昕组
物质科学与技术学院_博士生
共同第一作者Dai, Guohao
通讯作者Deng, Ruixiang; Yang, Jinshan; Dong, Shaoming
作者单位
1.Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China
2.Chinese Acad Sci, Shanghai Inst Ceram, Key Lab Inorgan Coating Mat CAS, Shanghai 200050, Peoples R China
3.Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China
4.Chinese Acad Sci, Struct Ceram & Composites Engn Res Ctr, Shanghai Inst Ceram, Shanghai 200050, Peoples R China
5.Univ Chinese Acad Sci, Beijing 100039, Peoples R China
6.ShanghaiTech Univ, Sch Phys Sci & Technol, Shanghai 201210, Peoples R China
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GB/T 7714
You, Xiao,Dai, Guohao,Deng, Ruixiang,et al. Fabrication of high-performance electromagnetic wave absorbing SiC composites reinforced by 3D printed carbon-based nanonetwork with Fe3O4 nanoparticles[J]. ADDITIVE MANUFACTURING,2022,55.
APA You, Xiao.,Dai, Guohao.,Deng, Ruixiang.,Zhang, Tao.,Song, Lixin.,...&Dong, Shaoming.(2022).Fabrication of high-performance electromagnetic wave absorbing SiC composites reinforced by 3D printed carbon-based nanonetwork with Fe3O4 nanoparticles.ADDITIVE MANUFACTURING,55.
MLA You, Xiao,et al."Fabrication of high-performance electromagnetic wave absorbing SiC composites reinforced by 3D printed carbon-based nanonetwork with Fe3O4 nanoparticles".ADDITIVE MANUFACTURING 55(2022).
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