Monolithic Integration of Released and Solidly Mounted RF Acoustic Devices on Heterogeneous Substrate

doi:10.1109/MEMS51670.2022.9699723

	Monolithic Integration of Released and Solidly Mounted RF Acoustic Devices on Heterogeneous Substrate
	Wu, Jinbo1,2,3 ; Zhang, Shibin 1; Zhou, Hongyan 1,2; Zhang, Liping 1,2; Zheng, Pengcheng 1,2; Yao, Hulin 1,2; Zhao, Xiaomeng 1; Huang, Kai 1; Wu, Tao3 ; Ou, Xin 1,2
	2022-01
会议录名称	IEEE SYMPOSIUM ON MASS STORAGE SYSTEMS AND TECHNOLOGIES
ISSN	2160-1968
卷号	2022-January
页码	1026-1029
发表状态	已发表
DOI	10.1109/MEMS51670.2022.9699723
摘要	This work first presents the monolithic integration of the solidly mounted surface acoustic wave (SAW) devices and the released Lamb wave devices on the Y128-cut LiNbO3-on-silicon (LNOSi) substrate. The Rayleigh mode SAW resonators showing a phase velocity (vp) of about 3700 m/s and effective electromechanical coupling coefficients (k2eff) between 7.3% to 9.5% are suitable for low-frequency and small-band filters, while the first order antisymmetric Lamb wave (A1) resonators showing scalable vp from 9476 m/s to 15280 m/s and k2eff between 9.2% to 23.4% are suitable for mid-, high-frequency and large-bandwidth filters. The Al mode and Rayleigh mode filters were also fabricated and measured, exhibiting 3-dB fractional bandwidths (FBW) of 5.5% and 2.4% around 2.1 GHz, respectively. The hybrid acoustic devices with complementary properties on LNOSi substrate show a great potential for applications in the hundred-filter sub-6 GHz RF front-ends. © 2022 IEEE.
会议录编者/会议主办者	IEEE ; IEEE MEMS Technical Community
关键词	Acoustic resonators Acoustic surface wave filters Bandwidth Electromechanical coupling Integration MEMS Monolithic integrated circuits Substrates Surface waves Acoustic filters Effective electro-mechanical coupling coefficients Heterogeneous substrates Hybrid acoustic device Lamb wave devices Linbo3-on-silicon Monolithic integration Rayleigh mode Silicon substrates Surface acoustic wave resonators
会议名称	35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
出版地	345 E 47TH ST, NEW YORK, NY 10017 USA
会议地点	Tokyo, Japan
会议日期	January 9, 2022 - January 13, 2022
URL	查看原文
收录类别	EI ; CPCI ; CPCI-S
语种	英语
资助项目	National Key R&D Program of China[
WOS研究方向	Engineering ; Science & Technology - Other Topics
WOS类目	Engineering, Electrical & Electronic ; Engineering, Mechanical ; Nanoscience & Nanotechnology
WOS记录号	WOS:000784358100261
出版者	IEEE Computer Society
EI入藏号	20221211807221
EI主题词	Silicon
EI分类号	549.3 Nonferrous Metals and Alloys excluding Alkali and Alkaline Earth Metals ; 704.2 Electric Equipment ; 714.2 Semiconductor Devices and Integrated Circuits ; 716.1 Information Theory and Signal Processing ; 752.1 Acoustic Devices ; 921.2 Calculus
原始文献类型	Conference article (CA)
来源库	IEEE
引用统计	正在获取...
文献类型	会议论文
条目标识符	https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/167143
专题	信息科学与技术学院_博士生信息科学与技术学院_PI研究组_吴涛组
通讯作者	Zhang, Shibin; Wu, Tao; Ou, Xin
作者单位	1.Shanghai Inst Microsyst & Informat Technol, State Key Lab Funct Mat Informat, Shanghai 200050, Peoples R China 2.Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China 3.ShanghaiTech Univ, Shanghai 201210, Peoples R China
第一作者单位	上海科技大学
通讯作者单位	上海科技大学
推荐引用方式 GB/T 7714	Wu, Jinbo,Zhang, Shibin,Zhou, Hongyan,et al. Monolithic Integration of Released and Solidly Mounted RF Acoustic Devices on Heterogeneous Substrate[C]//IEEE, IEEE MEMS Technical Community. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE Computer Society,2022:1026-1029.