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Patterning of Wafer-Scale MXene Films for High-Performance Image Sensor Arrays
2022-04-27
发表期刊ADVANCED MATERIALS (IF:27.4[JCR-2023],30.2[5-Year])
ISSN0935-9648
EISSN1521-4095
发表状态已发表
DOI10.1002/adma.202201298
摘要

As a rapidly growing family of 2D transition metal carbides and nitrides, MXenes are recognized as promising materials for the development of future electronics and optoelectronics. So far, the reported patterning methods for MXene films lack efficiency, resolution, and compatibility, resulting in limited device integration and performance. Here, a high-performance MXene image sensor array fabricated by a wafer-scale combination patterning method of an MXene film is reported. This method combines MXene centrifugation, spin-coating, photolithography, and dry-etching and is highly compatible with mainstream semiconductor processing, with a resolution up to 2 µm, which is at least 100 times higher than other large-area patterning methods reported previously. As a result, a high-density integrated array of 1024-pixel Ti3C2Tx/Si photodetectors with a detectivity of 7.73 × 1014 Jones and a light–dark current ratio (Ilight/Idark) of 6.22 × 106, which is the ultrahigh value among all reported MXene-based photodetectors, is fabricated. This patterning technique paves a way for large-scale high-performance MXetronics compatible with mainstream semiconductor processes. © 2022 Wiley-VCH GmbH.

关键词Carbides Dry etching Image sensors Photodetectors Silicon wafers Transition metals Image sensor array Mxene photodetector Mxenes Patterning methods Patterning technology Performance Transition metal nitrides Transition metals carbides Wafer scale Wafer-scale patterning technology
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收录类别SCI ; EI ; SCIE
语种英语
资助项目Strategic Priority Research Program of Chinese Academy of Sciences[XDB30000000] ; Key Research Program of Frontier Sciences of the Chinese Academy of Sciences[ZDBSLY-JSC027] ; Liaoning Revitalization Talents Program[XLYC1807109] ; Shandong Natural Science Foundation of China[ZR2019ZD49] ; National Natural Science Foundation of China[62074150,61704175] ; Chinese Academy of Sciences[SKLA-2019-03]
WOS研究方向Chemistry ; Science & Technology - Other Topics ; Materials Science ; Physics
WOS类目Chemistry, Multidisciplinary ; Chemistry, Physical ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号WOS:000770788700001
出版者John Wiley and Sons Inc
EI入藏号20221211811997
EI主题词Photons
EI分类号531 Metallurgy and Metallography ; 714.2 Semiconductor Devices and Integrated Circuits ; 802.2 Chemical Reactions ; 804.2 Inorganic Compounds ; 812.1 Ceramics ; 931.3 Atomic and Molecular Physics
原始文献类型Article in Press
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文献类型期刊论文
条目标识符https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/165059
专题物质科学与技术学院_博士生
通讯作者Liu, Chi; Wang, Xiao-Mu; Wang, Xiao-Hui; Sun, Dong-Ming
作者单位
1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, 96 Jinzhai Rd, Hefei 230026, Peoples R China
3.Yanshan Univ, Coll Mech Engn, Natl Engn Res Ctr Equipment & Technol Cold Strip, Qinhuangdao 066004, Hebei, Peoples R China
4.ShanghaiTech Univ, Sch Phys Sci & Technol, 393 Huaxiazhong Rd, Shanghai 200031, Peoples R China
5.Nanjing Univ, Collaborat Innovat Ctr Adv Microstruct, Sch Elect Sci & Engn, Sch Phys,Natl Lab Solid State Microstruct, Nanjing 210008, Peoples R China
6.Chinese Acad Sci, Suzhou Inst Nanotech & Nanobion, 398 Ruoshui Rd, Suzhou 215123, Peoples R China
7.Chinese Acad Sci, Shenzhen Inst Adv Technol, Inst Technol Carbon Neutral, 1068 Xueyuan Ave, Shenzhen 518055, Peoples R China
推荐引用方式
GB/T 7714
Li, Bo,Zhu, Qian-Bing,Cui, Cong,et al. Patterning of Wafer-Scale MXene Films for High-Performance Image Sensor Arrays[J]. ADVANCED MATERIALS,2022.
APA Li, Bo.,Zhu, Qian-Bing.,Cui, Cong.,Liu, Chi.,Wang, Zuo-Hua.,...&Sun, Dong-Ming.(2022).Patterning of Wafer-Scale MXene Films for High-Performance Image Sensor Arrays.ADVANCED MATERIALS.
MLA Li, Bo,et al."Patterning of Wafer-Scale MXene Films for High-Performance Image Sensor Arrays".ADVANCED MATERIALS (2022).
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