Dielectric Breakdown in Chemical Vapor Deposited Hexagonal Boron Nitride
2017-11-15
发表期刊ACS APPLIED MATERIALS & INTERFACES
ISSN1944-8244
卷号9期号:45页码:39758-39770
发表状态已发表
DOI10.1021/acsami.7b10948
摘要Insulating films are essential in multiple electronic devices because they can provide essential functionalities, such as capacitance effects and electrical fields. Two-dimensional (2D) layered materials have superb electronic, physical, chemical, thermal, and optical properties, and they can be effectively used to provide additional performances, such as flexibility and transparency. 2D layered insulators are called to be essential in future electronic devices, but their reliability, degradation kinetics, and dielectric breakdown (BD) process are still not understood. In this work, the dielectric breakdown process of multilayer hexagonal 0 boron nitride (h-BN) is analyzed on the nanoscale and on the device level, and the experimental results are studied via theoretical models. It is found that under electrical stress, local charge accumulation and charge trapping/detrapping are the onset mechanisms for dielectric BD formation. By means of conductive atomic force microscopy, the BD event was triggered at several locations on the surface of different dielectrics (SiO2, HfO2, Al2O3, multilayer h-BN, and monolayer h-BN); BD-induced hillocks rapidly appeared on the surface of all of them when the BD was reached, except in monolayer h-BN. The high thermal conductivity of h-BN combined with the one-atom-thick nature are genuine factors contributing to heat dissipation at the BD spot, which avoids self-accelerated and thermally driven catastrophic BD. These results point to monolayer h-BN as a sublime dielectric in terms of reliability, which may have important implications in future digital electronic devices.
关键词dielectric breakdown 2D materials insulator hexagonal boron nitride CAFM
收录类别SCI ; EI
语种英语
资助项目National Technological University (UTN.BA)[PIDUTN2014/UTI2423]
WOS研究方向Science & Technology - Other Topics ; Materials Science
WOS类目Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary
WOS记录号WOS:000416203800069
出版者AMER CHEMICAL SOC
EI入藏号20174704449014
EI主题词Atomic force microscopy ; Boron nitride ; Degradation ; Dielectric materials ; Digital devices ; Electric breakdown ; Electron devices ; Electronic equipment ; Hafnium oxides ; Monolayers ; Multilayers ; Nitrides ; Optical properties ; Silica ; Thermal conductivity ; Thermoelectric equipment
EI分类号Thermoelectric Energy:615.4 ; Thermodynamics:641.1 ; Electricity: Basic Concepts and Phenomena:701.1 ; Dielectric Materials:708.1 ; Light/Optics:741.1 ; Optical Devices and Systems:741.3 ; Chemical Reactions:802.2 ; Chemical Products Generally:804 ; Inorganic Compounds:804.2
WOS关键词SUPERIOR THERMAL-CONDUCTIVITY ; TEMPERATURE-DEPENDENT RAMAN ; FIELD-EFFECT TRANSISTORS ; DEGRADATION ; NANOSCALE ; FILMS ; SIO2 ; GROWTH
原始文献类型Article
引用统计
文献类型期刊论文
条目标识符https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/14287
专题物质科学与技术学院_特聘教授组_谢晓明组
通讯作者Lanza, Mario
作者单位
1.Soochow Univ, Inst Funct Nano & Soft Mat, Collaborat Innovat Ctr Suzhou Nanosci & Technol, 199 Ren Ai Rd, Suzhou 215123, Peoples R China
2.Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
3.Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA
4.MIT, Dept Elect Engn & Comp Sci, 77 Massachusetts Ave, Cambridge, MA 02139 USA
5.Univ Texas Austin, Microelect Res Ctr, Austin, TX 78758 USA
6.Univ Texas Austin, Dept Elect & Comp Engn, Austin, TX 78758 USA
7.Univ Manchester, Microelect & Nanostruct, Sackville St, Manchester M13 9PL, Lancs, England
8.UTN CNEA, Natl Sci & Tech Res Council CONICET, Godoy Cruz 2290, Buenos Aires, DF, Argentina
9.Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Funct Mat Informat, 865 Changning Rd, Shanghai 200050, Peoples R China
10.ShanghaiTech Univ, Sch Phys Sci & Technol, 319 Yueyang Rd, Shanghai 201210, Peoples R China
推荐引用方式
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Jiang, Lanlan,Shi, Yuanyuan,Hui, Fei,et al. Dielectric Breakdown in Chemical Vapor Deposited Hexagonal Boron Nitride[J]. ACS APPLIED MATERIALS & INTERFACES,2017,9(45):39758-39770.
APA Jiang, Lanlan.,Shi, Yuanyuan.,Hui, Fei.,Tang, Kechao.,Wu, Qian.,...&Lanza, Mario.(2017).Dielectric Breakdown in Chemical Vapor Deposited Hexagonal Boron Nitride.ACS APPLIED MATERIALS & INTERFACES,9(45),39758-39770.
MLA Jiang, Lanlan,et al."Dielectric Breakdown in Chemical Vapor Deposited Hexagonal Boron Nitride".ACS APPLIED MATERIALS & INTERFACES 9.45(2017):39758-39770.
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