Simulation Study of Front-illuminated GaN Avalanche Photodiodes with Hole-initiated Multiplication
2019-05
会议录名称2019 COMPOUND SEMICONDUCTOR WEEK (CSW)
页码1
发表状态已发表
DOI10.1109/ICIPRM.2019.8819123
摘要

III-N based Avalanche Photodiodes (APD) are of great interest for UV detection due to their low dark current density, high sensitivity, and high optical gain. In this paper, we propose and study via simulation a novel flip-chip (Al)GaN p-i-n-i-n APD which combines the features of the prevailing APDs-hole-initiated multiplication process and front-illumination. The proposed APDs could be obtained through a thin film transfer and substrate removal process, ending up with a cathode facing-up structure. Additionally, in order to reduce undesirable UV absorption ( λ = 340 nm or shorter) in the optical path, AIGaN-APD with a UV-transparent n-Al0.4GaN layer was also designed for comparisons. With a 200-nm-thick multiplication layer, the calculated breakdown voltage was around 95 V for both GaN-APD and AlGaN APD, whose optical gain could reach 105 and 106, respectively, mainly contributed by hole-initiated multiplication process. Due to the absence of UV light absorption in the top layer, the AlGaN APD shows responsivity (R=25mA/W, EQE=9.1 %) twice as much as that of GaN APD with a reverse bias of 60 V. At the reverse bias of 94 V, the responsivity increases to 27.3 mA/W, corresponding to an EQE of 100% because of internal gain.

会议地点Nara, Japan
会议日期19-23 May 2019
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收录类别CPCI ; CPCI-S
语种英语
WOS记录号WOS:000539485600133
出版者IEEE
原始文献类型Proceedings Paper
来源库IEEE
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文献类型会议论文
条目标识符https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/102110
专题信息科学与技术学院_硕士生
作者单位
1.School of Information Science and Technology, ShanghaiTech University, Shanghai, China
2.School of Electronics and Information Technology, Sun Yat-sen University, Guangzhou, China
3.GaNology Semiconductor Co., Ltd, China
第一作者单位信息科学与技术学院
第一作者的第一单位信息科学与技术学院
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Yangqian Wang,Yuliang Zhang,Yang A. Yang,et al. Simulation Study of Front-illuminated GaN Avalanche Photodiodes with Hole-initiated Multiplication[C]:IEEE,2019:1.
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