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ShanghaiTech University Knowledge Management System
High-order Piezoelectric Micromachined Ultrasonic Transducer with Piezoelectric Layer Trench for Ultrasound Imaging | |
2025 | |
发表期刊 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (IF:2.5[JCR-2023],2.6[5-Year]) |
ISSN | 1941-0158 |
发表状态 | 已投递待接收 |
摘要 | This letter presents a high-order PZT PMUT (HO-PMUT) array with trenched piezoelectric layer operating at 1.78 MHz. This high-order and trench design boosts the resonant frequency to MHz without reducing the radius, while increasing vibration amplitude and Q factor compared to fundamental PMUTs. Through simulation-optimized dual electrodes, the array achieved a normalized transmitting sensitivity (TS) of 19 kPa*mm*V-1*mm-2. We demonstrated its pioneering application in ultrasound imaging by mechanically scanning a steel sample and generating a B-mode image with 7.34 dB SNR, showcasing its superior acoustic performance and potential for portable ultrasonic imaging devices. |
关键词 | Piezoelectric micromachined ultrasonic transducer (PMUT), high order, trench, output pressure. |
学科门类 | 工学 |
语种 | 英语 |
文献类型 | 期刊论文 |
条目标识符 | https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/507126 |
专题 | 信息科学与技术学院_PI研究组_吴涛组 信息科学与技术学院_博士生 |
通讯作者 | Tao Wu |
作者单位 | 1.School of Information Science and Technology, ShanghaiTech University, Shanghai 201210, China 2.Shanghai Engineering Research Center of Energy Efficient and Custom AI IC, Shanghai 201210, China |
第一作者单位 | 信息科学与技术学院 |
通讯作者单位 | 信息科学与技术学院 |
第一作者的第一单位 | 信息科学与技术学院 |
推荐引用方式 GB/T 7714 | Junxiang Cai,Yiwei Wang,Tao Wu. High-order Piezoelectric Micromachined Ultrasonic Transducer with Piezoelectric Layer Trench for Ultrasound Imaging[J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,2025. |
APA | Junxiang Cai,Yiwei Wang,&Tao Wu.(2025).High-order Piezoelectric Micromachined Ultrasonic Transducer with Piezoelectric Layer Trench for Ultrasound Imaging.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. |
MLA | Junxiang Cai,et al."High-order Piezoelectric Micromachined Ultrasonic Transducer with Piezoelectric Layer Trench for Ultrasound Imaging".JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2025). |
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