消息
×
loading..
Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio
2025-03-01
发表期刊MATERIALS (IF:3.1[JCR-2023],3.4[5-Year])
ISSN1996-1944
EISSN1996-1944
卷号18期号:5
发表状态已发表
DOI10.3390/ma18050960
摘要

Buffered chemical polishing (BCP) is an important and widely used polishing technique for superconducting radio-frequency (SRF) cavities made of niobium. A common problem encountered during BCP is the formation of bubbles and W-shaped pits on the cavity surface, which may severely limit the RF performance. We report a method to address the problem of W-shaped pits through optimizing the BCP acid ratio. We systematically investigate the effect of the BCP acid ratio through sample and cavity BCP experiments and determine an optimal ratio for the three acids. The new BCP recipe with the optimal acid ratio is verified through the development of niobium cavities with several different shapes, which are shown to be free of pits and demonstrate excellent RF performance; notably, several 3.9 GHz nine-cell cavities present unprecedented accelerating gradients. Furthermore, the findings suggest a simple pit-free BCP recipe that does not require H3PO4, using only HF and HNO3. The method proposed in this study is also appropriate for suppressing pit formation with other acid mixtures or when polishing other metal objects.

关键词superconducting radio-frequency cavity buffered chemical polishing acid ratio pit bubble viscosity
URL查看原文
收录类别SCI
语种英语
资助项目CAS Program[Y82G011252] ; null[2017SHZDZX02]
WOS研究方向Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering ; Physics
WOS类目Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Physics, Applied ; Physics, Condensed Matter
WOS记录号WOS:001442718900001
出版者MDPI
文献类型期刊论文
条目标识符https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/503574
专题大科学中心_公共科研平台_变革性技术研发部
硬x射线自由电子激光装置项目
大科学中心_PI研究组_柳学榕组
物质科学与技术学院_硕士生
物质科学与技术学院_博士生
大科学中心
通讯作者Chen, Jinfang
作者单位
1.Chinese Acad Sci, Shanghai Inst Appl Phys, Shanghai 201800, Peoples R China
2.Univ Chinese Acad Sci, Beijing 101408, Peoples R China
3.Chinese Acad Sci, Shanghai Adv Res Inst, Shanghai 201204, Peoples R China
4.ShanghaiTech Univ, Ctr Transformat Sci, Shanghai 201210, Peoples R China
5.Zhangjiang Lab, Shanghai 201210, Peoples R China
通讯作者单位上海科技大学
推荐引用方式
GB/T 7714
Wang, Zheng,Chen, Jinfang,Zong, Yue,et al. Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio[J]. MATERIALS,2025,18(5).
APA Wang, Zheng.,Chen, Jinfang.,Zong, Yue.,Xing, Shuai.,Wu, Jiani.,...&Wang, Dong.(2025).Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio.MATERIALS,18(5).
MLA Wang, Zheng,et al."Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio".MATERIALS 18.5(2025).
条目包含的文件
文件名称/大小 文献类型 版本类型 开放类型 使用许可
个性服务
查看访问统计
谷歌学术
谷歌学术中相似的文章
[Wang, Zheng]的文章
[Chen, Jinfang]的文章
[Zong, Yue]的文章
百度学术
百度学术中相似的文章
[Wang, Zheng]的文章
[Chen, Jinfang]的文章
[Zong, Yue]的文章
必应学术
必应学术中相似的文章
[Wang, Zheng]的文章
[Chen, Jinfang]的文章
[Zong, Yue]的文章
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。