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ShanghaiTech University Knowledge Management System
Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio | |
2025-03-01 | |
发表期刊 | MATERIALS (IF:3.1[JCR-2023],3.4[5-Year]) |
ISSN | 1996-1944 |
EISSN | 1996-1944 |
卷号 | 18期号:5 |
发表状态 | 已发表 |
DOI | 10.3390/ma18050960 |
摘要 | Buffered chemical polishing (BCP) is an important and widely used polishing technique for superconducting radio-frequency (SRF) cavities made of niobium. A common problem encountered during BCP is the formation of bubbles and W-shaped pits on the cavity surface, which may severely limit the RF performance. We report a method to address the problem of W-shaped pits through optimizing the BCP acid ratio. We systematically investigate the effect of the BCP acid ratio through sample and cavity BCP experiments and determine an optimal ratio for the three acids. The new BCP recipe with the optimal acid ratio is verified through the development of niobium cavities with several different shapes, which are shown to be free of pits and demonstrate excellent RF performance; notably, several 3.9 GHz nine-cell cavities present unprecedented accelerating gradients. Furthermore, the findings suggest a simple pit-free BCP recipe that does not require H3PO4, using only HF and HNO3. The method proposed in this study is also appropriate for suppressing pit formation with other acid mixtures or when polishing other metal objects. |
关键词 | superconducting radio-frequency cavity buffered chemical polishing acid ratio pit bubble viscosity |
URL | 查看原文 |
收录类别 | SCI |
语种 | 英语 |
资助项目 | CAS Program[Y82G011252] ; null[2017SHZDZX02] |
WOS研究方向 | Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering ; Physics |
WOS类目 | Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Physics, Applied ; Physics, Condensed Matter |
WOS记录号 | WOS:001442718900001 |
出版者 | MDPI |
文献类型 | 期刊论文 |
条目标识符 | https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/503574 |
专题 | 大科学中心_公共科研平台_变革性技术研发部 硬x射线自由电子激光装置项目 大科学中心_PI研究组_柳学榕组 物质科学与技术学院_硕士生 物质科学与技术学院_博士生 大科学中心 |
通讯作者 | Chen, Jinfang |
作者单位 | 1.Chinese Acad Sci, Shanghai Inst Appl Phys, Shanghai 201800, Peoples R China 2.Univ Chinese Acad Sci, Beijing 101408, Peoples R China 3.Chinese Acad Sci, Shanghai Adv Res Inst, Shanghai 201204, Peoples R China 4.ShanghaiTech Univ, Ctr Transformat Sci, Shanghai 201210, Peoples R China 5.Zhangjiang Lab, Shanghai 201210, Peoples R China |
通讯作者单位 | 上海科技大学 |
推荐引用方式 GB/T 7714 | Wang, Zheng,Chen, Jinfang,Zong, Yue,et al. Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio[J]. MATERIALS,2025,18(5). |
APA | Wang, Zheng.,Chen, Jinfang.,Zong, Yue.,Xing, Shuai.,Wu, Jiani.,...&Wang, Dong.(2025).Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio.MATERIALS,18(5). |
MLA | Wang, Zheng,et al."Avoiding the Formation of Bubbles and Pits in Buffered Chemical Polishing for the Niobium Superconducting Cavity Through Adjusting the Acid Ratio".MATERIALS 18.5(2025). |
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