Addressing Aging Issues in Heterogeneous Three-Dimensional Integrated Circuits

doi:10.1109/ASICON47005.2019.8983595

	Addressing Aging Issues in Heterogeneous Three-Dimensional Integrated Circuits
	Yu Ma; Dingcheng Jia; Wei Gao; Pingqiang Zhou
	2019-10
会议录名称	2019 IEEE 13TH INTERNATIONAL CONFERENCE ON ASIC (ASICON)
ISSN	2162-7541
页码	1-4
发表状态	已发表
DOI	10.1109/ASICON47005.2019.8983595
摘要	Heterogeneous three-dimensional (3D) integrated technique is a promising method to achieve breakthrough bandwidth between DRAM and CPU in a computer system. However, in such stacked structure, the elevated temperature poses big challenges to the circuit reliability. In this paper, we provide our solutions to three instability effects in the 3D stack: bias temperature instability, time dependent dielectric breakdown and electromigration.
会议地点	Chongqing, China
会议日期	29 Oct.-1 Nov. 2019
URL	查看原文
收录类别	EI ; CPCI ; CPCI-S
语种	英语
WOS研究方向	Engineering ; Telecommunications
WOS类目	Engineering, Electrical & Electronic ; Telecommunications
WOS记录号	WOS:000541465700165
EI入藏号	20201408379160
EI主题词	Dielectric materials ; Timing circuits
EI分类号	Dielectric Materials:708.1 ; Pulse Circuits:713.4 ; Semiconductor Devices and Integrated Circuits:714.2
WOS关键词	MODEL
原始文献类型	Proceedings Paper
来源库	IEEE
引用统计	正在获取...
文献类型	会议论文
条目标识符	https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/49938
专题	信息科学与技术学院_博士生信息科学与技术学院_PI研究组_周平强组信息科学与技术学院_硕士生
作者单位	School of Information Science and Technology, ShanghaiTech University,Shanghai,China,201210
第一作者单位	信息科学与技术学院
第一作者的第一单位	信息科学与技术学院
推荐引用方式 GB/T 7714	Yu Ma,Dingcheng Jia,Wei Gao,et al. Addressing Aging Issues in Heterogeneous Three-Dimensional Integrated Circuits[C],2019:1-4.