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Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing | |
2025-02-01 | |
发表期刊 | MATERIALS (IF:3.1[JCR-2023],3.4[5-Year]) |
ISSN | 1996-1944 |
EISSN | 1996-1944 |
卷号 | 18期号:4 |
发表状态 | 已发表 |
DOI | 10.3390/ma18040865 |
摘要 | Superconducting radio-frequency niobium cavities processed using buffered chemical polishing (BCP) sometimes show typical W-shaped pits on their surface, which may greatly limit their performance. However, the causes of such pits and effective solutions are not fully understood. In this study, we reproduced the formation of W-shaped pits on the cavity surface through niobium sample BCP experiments, directly observed the sample surface's evolution during the polishing process and the polished surface's morphology, and analyzed the cause of W-shaped pits in detail: the formation and attachment of bubbles on the niobium surface during the BCP process. Then, we systematically investigated the effects of different process parameters on the bubbles and pits, including the acid ratio, temperature, and flow rate. We also investigated how the formation of bubbles and pits was affected by the Nb facing orientation and grain size. This study provides insights into the mechanisms by which bubbles and W-shaped pits are formed on niobium surfaces, and highlights possible directions for reducing pit defects in Nb cavities processed using BCP treatment. |
关键词 | superconducting cavity buffered chemical polishing (BCP) pit bubble niobium sample mechanism |
URL | 查看原文 |
收录类别 | SCI ; EI |
语种 | 英语 |
资助项目 | CAS Program[Y82G011252] ; null[2017SHZDZX02] |
WOS研究方向 | Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering ; Physics |
WOS类目 | Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Physics, Applied ; Physics, Condensed Matter |
WOS记录号 | WOS:001430119800001 |
出版者 | MDPI |
EI入藏号 | 20250917974717 |
EI主题词 | Niobium metallography |
EI分类号 | 1301.2.1.1 Particle Accelerators - 201.1.2 Metallography - 201.6.1 Powder Metallurgy Operations - 202.9.3 Others, including Bismuth, Boron, Cadmium, Cobalt, Mercury, Niobium, Selenium, Silicon, Tellurium and Zirconium - 801.3 Physical Chemistry - 802.2 Chemical Reactions - 802.3 Chemical Operations - 942.2.3 Abrasive Devices and Processes |
原始文献类型 | Journal article (JA) |
引用统计 | 正在获取...
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文献类型 | 期刊论文 |
条目标识符 | https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/496884 |
专题 | 大科学中心_公共科研平台_变革性技术研发部 硬x射线自由电子激光装置项目 大科学中心_PI研究组_柳学榕组 物质科学与技术学院_硕士生 物质科学与技术学院_博士生 信息科学与技术学院_博士生 大科学中心 |
通讯作者 | Chen, Jinfang |
作者单位 | 1.Chinese Acad Sci, Shanghai Inst Appl Phys, Shanghai 201800, Peoples R China 2.Univ Chinese Acad Sci, Beijing 101408, Peoples R China 3.Chinese Acad Sci, Shanghai Adv Res Inst, Shanghai 201204, Peoples R China 4.ShanghaiTech Univ, Ctr Transformat Sci, Shanghai 201210, Peoples R China 5.Zhangjiang Lab, Shanghai 201210, Peoples R China |
通讯作者单位 | 上海科技大学 |
推荐引用方式 GB/T 7714 | Wang, Zheng,Chen, Jinfang,Huang, Yawei,et al. Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing[J]. MATERIALS,2025,18(4). |
APA | Wang, Zheng.,Chen, Jinfang.,Huang, Yawei.,Zong, Yue.,Xing, Shuai.,...&Wang, Dong.(2025).Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing.MATERIALS,18(4). |
MLA | Wang, Zheng,et al."Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing".MATERIALS 18.4(2025). |
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