Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing
2025-02-01
发表期刊MATERIALS (IF:3.1[JCR-2023],3.4[5-Year])
ISSN1996-1944
EISSN1996-1944
卷号18期号:4
发表状态已发表
DOI10.3390/ma18040865
摘要

Superconducting radio-frequency niobium cavities processed using buffered chemical polishing (BCP) sometimes show typical W-shaped pits on their surface, which may greatly limit their performance. However, the causes of such pits and effective solutions are not fully understood. In this study, we reproduced the formation of W-shaped pits on the cavity surface through niobium sample BCP experiments, directly observed the sample surface's evolution during the polishing process and the polished surface's morphology, and analyzed the cause of W-shaped pits in detail: the formation and attachment of bubbles on the niobium surface during the BCP process. Then, we systematically investigated the effects of different process parameters on the bubbles and pits, including the acid ratio, temperature, and flow rate. We also investigated how the formation of bubbles and pits was affected by the Nb facing orientation and grain size. This study provides insights into the mechanisms by which bubbles and W-shaped pits are formed on niobium surfaces, and highlights possible directions for reducing pit defects in Nb cavities processed using BCP treatment.

关键词superconducting cavity buffered chemical polishing (BCP) pit bubble niobium sample mechanism
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收录类别SCI ; EI
语种英语
资助项目CAS Program[Y82G011252] ; null[2017SHZDZX02]
WOS研究方向Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering ; Physics
WOS类目Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Physics, Applied ; Physics, Condensed Matter
WOS记录号WOS:001430119800001
出版者MDPI
EI入藏号20250917974717
EI主题词Niobium metallography
EI分类号1301.2.1.1 Particle Accelerators - 201.1.2 Metallography - 201.6.1 Powder Metallurgy Operations - 202.9.3 Others, including Bismuth, Boron, Cadmium, Cobalt, Mercury, Niobium, Selenium, Silicon, Tellurium and Zirconium - 801.3 Physical Chemistry - 802.2 Chemical Reactions - 802.3 Chemical Operations - 942.2.3 Abrasive Devices and Processes
原始文献类型Journal article (JA)
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文献类型期刊论文
条目标识符https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/496884
专题大科学中心_公共科研平台_变革性技术研发部
硬x射线自由电子激光装置项目
大科学中心_PI研究组_柳学榕组
物质科学与技术学院_硕士生
物质科学与技术学院_博士生
信息科学与技术学院_博士生
大科学中心
通讯作者Chen, Jinfang
作者单位
1.Chinese Acad Sci, Shanghai Inst Appl Phys, Shanghai 201800, Peoples R China
2.Univ Chinese Acad Sci, Beijing 101408, Peoples R China
3.Chinese Acad Sci, Shanghai Adv Res Inst, Shanghai 201204, Peoples R China
4.ShanghaiTech Univ, Ctr Transformat Sci, Shanghai 201210, Peoples R China
5.Zhangjiang Lab, Shanghai 201210, Peoples R China
通讯作者单位上海科技大学
推荐引用方式
GB/T 7714
Wang, Zheng,Chen, Jinfang,Huang, Yawei,et al. Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing[J]. MATERIALS,2025,18(4).
APA Wang, Zheng.,Chen, Jinfang.,Huang, Yawei.,Zong, Yue.,Xing, Shuai.,...&Wang, Dong.(2025).Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing.MATERIALS,18(4).
MLA Wang, Zheng,et al."Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing".MATERIALS 18.4(2025).
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