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ShanghaiTech University Knowledge Management System
| Three-dimensional imaging of buried interfaces with multislice ptychography | |
| 2023-09-19 | |
| 状态 | 已发表 |
| 摘要 | We demonstrate the application of multislice ptychography to a twisted hexagonal boron nitride (h-BN) heterointerface from a single-view data set. The propagation from the top flake, through the interface, to the bottom flake is visualized from separate slices of the reconstruction. The depth resolution of the reconstruction is determined to be 2.74 nm, which is a significant improvement over the aperture-limited depth resolution of 6.74 nm. This is attributed to the diffraction signal extending beyond the aperture edge with the depth resolution set by the curvature of the Ewald sphere. Future advances to this approach could improve the depth resolution to the sub-nanometer level and enable the identification of individual dopants, defects and color centers in twisted heterointerfaces and other materials. |
| DOI | arXiv:2308.15471 |
| 相关网址 | 查看原文 |
| 出处 | Arxiv |
| WOS记录号 | PPRN:84495136 |
| WOS类目 | Physics, Applied ; Physics, Condensed Matter |
| 资助项目 | US Department of Energy, Office of Science, Basic Energy Sciences, Division of Materials Sciences and Engineering[ |
| 文献类型 | 预印本 |
| 条目标识符 | https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/381353 |
| 专题 | 物质科学与技术学院 大科学中心_PI研究组_江怀东组 大科学中心_公共科研平台_大科学装置建设部 |
| 通讯作者 | Miao, Jianwei |
| 作者单位 | 1.Univ Calif Los Angeles, Dept Phys & Astron, Los Angeles, CA 90095, USA 2.Univ Calif Los Angeles, Calif Nano Syst Inst, Los Angeles, CA 90095, USA 3.ShanghaiTech Univ, Sch Phys Sci & Technol, Shanghai 201210, Peoples R China 4.Univ Calif Berkeley, Dept Phys, Berkeley, CA 94720, USA 5.Lawrence Berkeley Natl Lab, Mat Sci Div, Berkeley, CA 94720, USA 6.Univ Calif Berkeley, Kavli Energy Nanosci Inst, Berkeley, CA 94720, USA 7.Lawrence Berkeley Natl Lab, Natl Ctr Electron Microscopy Facil, Mol Foundry, Berkeley, CA 94720, USA |
| 推荐引用方式 GB/T 7714 | O'Leary, Colum M.,Zhang, Jianhua,Su, Cong,et al. Three-dimensional imaging of buried interfaces with multislice ptychography. 2023. |
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