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osmAG: Hierarchical Semantic Topometric Area Graph Maps in the OSM Format for Mobile Robotics
2023-12-09
会议录名称2023 IEEE INTERNATIONAL CONFERENCE ON ROBOTICS AND BIOMIMETICS (ROBIO)
发表状态已发表
DOI10.1109/ROBIO58561.2023.10354976
摘要Maps are essential to mobile robotics tasks like localization and planning. We propose the open street map (osm) XML based Area Graph file format to store hierarchical, topometric semantic multi-floor maps of indoor and outdoor environments, since currently no such format is popular within the robotics community. Building on-top of osm we leverage the available open source editing tools and libraries of osm, while adding the needed mobile robotics aspect with building-level obstacle representation yet very compact, topometric data that facilitates planning algorithms. Through the use of common osm keys as well as custom ones we leverage the power of semantic annotation to enable various applications. For example, we support planning based on robot capabilities, to take the locomotion mode and attributes in conjunction with the environment information into account. The provided C++ library is integrated into ROS. We evaluate the performance of osmAG using real data in a global path planning application on a very big osmAG map, demonstrating its convenience and effectiveness for mobile robots. © 2023 IEEE.
关键词Location awareness Three-dimensional displays Navigation Semantics XML C++ languages Libraries
会议名称2023 IEEE International Conference on Robotics and Biomimetics, ROBIO 2023
会议地点Koh Samui, Thailand
会议日期4-9 Dec. 2023
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收录类别EI
语种英语
出版者Institute of Electrical and Electronics Engineers Inc.
EI入藏号20240315404622
原始文献类型Conference article (CA)
来源库IEEE
文献类型会议论文
条目标识符https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/345911
专题信息科学与技术学院_硕士生
信息科学与技术学院_PI研究组_Sören Schwertfeger组
通讯作者Sören Schwertfeger
推荐引用方式
GB/T 7714
Delin Feng,Chengqian Li,Yongqi, Zhang,et al. osmAG: Hierarchical Semantic Topometric Area Graph Maps in the OSM Format for Mobile Robotics[C]:Institute of Electrical and Electronics Engineers Inc.,2023.
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