Synchronous Imaging and Multimodal Fusion of Optical and Electromagnetic Measurements for Overlapping Defects Inspection

doi:10.1109/TII.2023.3288881

	Synchronous Imaging and Multimodal Fusion of Optical and Electromagnetic Measurements for Overlapping Defects Inspection
	Na Zhang; Haoran Dong; Chaofeng Ye
	2023
发表期刊	IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS (IF:11.7[JCR-2023],11.4[5-Year])
ISSN	1551-3203
EISSN	1941-0050
卷号	PP 期号:99 页码:1-10
发表状态	已发表
DOI	10.1109/TII.2023.3288881
摘要	It is a challenging problem to accurately detect overlapping defects. This paper proposes a system that can obtain optical and electromagnetic signals synchronously. It contains an industrial camera, a chromatic confocal displacement sensor (CCDS) and an eddy current testing (ECT) probe with high-resolution array tunneling magnetoresistance (TMR) sensors. A multimodal fusion algorithm is proposed to combine the advantages of the optical testing and ECT. The fusion of the visual image and CCDS measurement results in morphology of the surface defects. To recognize the overlapping buried defect, a finite element method model is developed to estimate the surface defect signal using parameters from the optical measurements, and then the surface defect signal is subtracted from the experimental image, based on which the overlapping defects are precisely detected. This method can be widely used in industry to comprehensively assess the health and integrity of structures. IEEE
关键词	Charge coupled devices Computer vision Eddy current testing Morphology Optical data processing Surface defects Displacement sensor Eddy-current testing Electromagnetic measurement Machine-vision Multi-modal fusion Non destructive evaluation Optical imaging Optical measurement Optical surface waves Overlapping defects
URL	查看原文
收录类别	SCI ; EI
语种	英语
出版者	IEEE Computer Society
EI入藏号	20232714335167
EI主题词	Probes
EI分类号	714.2 Semiconductor Devices and Integrated Circuits ; 723.2 Data Processing and Image Processing ; 723.5 Computer Applications ; 741.2 Vision ; 931.2 Physical Properties of Gases, Liquids and Solids ; 951 Materials Science
原始文献类型	Article in Press
来源库	IEEE
文献类型	期刊论文
条目标识符	https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/316844
专题	信息科学与技术学院信息科学与技术学院_PI研究组_叶朝锋组信息科学与技术学院_硕士生信息科学与技术学院_博士生
通讯作者	Chaofeng Ye
作者单位	School of Information Science and Technology, ShanghaiTech University, Shanghai, China
第一作者单位	信息科学与技术学院
通讯作者单位	信息科学与技术学院
第一作者的第一单位	信息科学与技术学院
推荐引用方式 GB/T 7714	Na Zhang,Haoran Dong,Chaofeng Ye. Synchronous Imaging and Multimodal Fusion of Optical and Electromagnetic Measurements for Overlapping Defects Inspection[J]. IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS,2023,PP(99):1-10.
APA	Na Zhang,Haoran Dong,&Chaofeng Ye.(2023).Synchronous Imaging and Multimodal Fusion of Optical and Electromagnetic Measurements for Overlapping Defects Inspection.IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS,PP(99),1-10.
MLA	Na Zhang,et al."Synchronous Imaging and Multimodal Fusion of Optical and Electromagnetic Measurements for Overlapping Defects Inspection".IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS PP.99(2023):1-10.