Vector Magnetic Field Imaging With High-Resolution TMR Sensor Arrays for Metal Structure Inspection

doi:10.1109/JSEN.2022.3181366

	Vector Magnetic Field Imaging With High-Resolution TMR Sensor Arrays for Metal Structure Inspection
	Kai Sun1,2 ; Pan Qi 3; Xinchen Tao1,2 ; Wenlei Zhao1,2 ; Chaofeng Ye1,2
	2022
发表期刊	IEEE SENSORS JOURNAL (IF:4.3[JCR-2023],4.2[5-Year])
ISSN	2379-9153
卷号	22 期号:14
发表状态	已发表
DOI	10.1109/JSEN.2022.3181366
摘要	This paper proposes an eddy current testing (ECT) probe with high-resolution tunneling magnetoresistance (TMR) array sensors for vector magnetic field measurement. The probe consists of two printed circuit boards (PCBs), which are placed perpendicular to each other. Three arrays of TMR sensors are wire bonded on the two PCBs to measure the three components of the magnetic field. Each array contains 32 sensors and the distance between the centers of two adjacent sensors in an array is 0.5 mm. The 32 output signals of each array are multiplexed, amplified and filtered by using a circuit on the PCB. An experimental system is set up and aluminum samples with machined defects are imaged by the probe. It is seen that the patterns of the images along the x-, y- and z-axis are different, meaning the information in the three images can compensate each other to a certain extent. The images change their orientations if the defects are oriented along different angles. An image processing algorithm including image segmentation, normalization, edge detection and K-means classification is developed to class the defects. It is seen that the defects can be classified accurately with the algorithm. Then, the orientations of the defects are calculated from the images with a linear regression of the angles of the three axis images. It is found that the mean error of the orientation quantification is only 4.14°, which is much smaller than the mean error calculated from each axis image separately.
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收录类别	SCI ; EI ; SCIE
来源库	IEEE
引用统计	正在获取...
文献类型	期刊论文
条目标识符	https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/187924
专题	信息科学与技术学院信息科学与技术学院_PI研究组_叶朝锋组信息科学与技术学院_硕士生
作者单位	1.School of Information Science and Technology, ShanghaiTech University, Shanghai, China 2.Shanghai Engineering Research Center of Energy Efficient and Custom AI IC, Shanghai, China 3.China Nuclear Power Operation Technology Corporation Ltd., Wuhan, China
第一作者单位	信息科学与技术学院
第一作者的第一单位	信息科学与技术学院
推荐引用方式 GB/T 7714	Kai Sun,Pan Qi,Xinchen Tao,et al. Vector Magnetic Field Imaging With High-Resolution TMR Sensor Arrays for Metal Structure Inspection[J]. IEEE SENSORS JOURNAL,2022,22(14).
APA	Kai Sun,Pan Qi,Xinchen Tao,Wenlei Zhao,&Chaofeng Ye.(2022).Vector Magnetic Field Imaging With High-Resolution TMR Sensor Arrays for Metal Structure Inspection.IEEE SENSORS JOURNAL,22(14).
MLA	Kai Sun,et al."Vector Magnetic Field Imaging With High-Resolution TMR Sensor Arrays for Metal Structure Inspection".IEEE SENSORS JOURNAL 22.14(2022).