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Discovery of high-performance thermoelectric copper chalcogenide using modified diffusion-couple high-throughput synthesis and automated histogram analysis technique
2020-09
发表期刊ENERGY & ENVIRONMENTAL SCIENCE (IF:32.4[JCR-2023],34.5[5-Year])
ISSN1754-5692
卷号13期号:9页码:3041-3053
发表状态已发表
DOI10.1039/d0ee02209h
摘要

Discovery of novel high-performance materials with earth-abundant and environmentally friendly elements is a key task for civil applications based on advanced thermoelectric technology. Advancements in this area are greatly limited by the traditional trial-and-error method, which is both time-consuming and expensive. The materials genome initiative can provide a powerful strategy to screen for potential novel materials using high-throughput calculations, materials characterization, and synthesis. In this study, we developed a modified diffusion-couple high-throughput synthesis method and an automated histogram analysis technique to quickly screen high-performance copper chalcogenide thermoelectric materials, which has been well demonstrated in the ternary Cu-Sn-S compounds. A new copper chalcogenide with the composition of Cu(7)Sn(3)S(10)was discovered. Studies on crystal structure, band gap, and electrical and thermal transport properties were performed to show that it is a promising thermoelectric material with ultralow lattice thermal conductivity, moderate band gap, and decent electrical conductivity.ViaCl doping, the thermoelectric dimensionless figure of meritzTreaches 0.8 at 750 K, being among the highest values reported in Cu-Sn-S ternary materials. The modified diffusion-couple high-throughput synthesis method and automated histogram analysis technique developed in this study also shed light on the development of other advanced thermoelectric and functional materials.

收录类别SCI ; SCIE ; EI
资助项目National Key Research and Development Program of China[2018YFB0703600][2017YFB0701600] ; National Natural Science Foundation of China[51625205][91963208] ; CAS-DOE Program of Chinese Academy of Sciences[121631KYSB20180060] ; Youth Innovation Promotion Association of CAS[2016232] ; Shanghai Rising-Star Program[19QA1410200] ; NSF (USA) DMREF award[1729487]
WOS研究方向Chemistry ; Energy & Fuels ; Engineering ; Environmental Sciences & Ecology
WOS类目Chemistry, Multidisciplinary ; Energy & Fuels ; Engineering, Chemical ; Environmental Sciences
WOS记录号WOS:000570224500023
出版者ROYAL SOC CHEMISTRY
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文献类型期刊论文
条目标识符https://kms.shanghaitech.edu.cn/handle/2MSLDSTB/123588
专题物质科学与技术学院_博士生
通讯作者Qiu, Pengfei; Snyder, G. Jeffrey; Shi, Xun
作者单位
1.Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China;
2.Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China;
3.Shanghai Tech Univ, Sch Phys Sci & Technol, Shanghai 201210, Peoples R China;
4.Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA;
5.Shanghai Univ, Mat Genome Inst, Shanghai 200444, Peoples R China;
6.Helmholtz Zentrum Dresden Rossendorf, Inst Ion Beam Phys & Mat Res, D-01328 Dresden, Germany;
7.Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Shanghai 200240, Peoples R China;
8.Max Planck Inst Chem Phys Fester Stoffe, Dresden, Germany
第一作者单位物质科学与技术学院
推荐引用方式
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Deng, Tingting,Xing, Tong,Brod, Madison K.,et al. Discovery of high-performance thermoelectric copper chalcogenide using modified diffusion-couple high-throughput synthesis and automated histogram analysis technique[J]. ENERGY & ENVIRONMENTAL SCIENCE,2020,13(9):3041-3053.
APA Deng, Tingting.,Xing, Tong.,Brod, Madison K..,Sheng, Ye.,Qiu, Pengfei.,...&Shi, Xun.(2020).Discovery of high-performance thermoelectric copper chalcogenide using modified diffusion-couple high-throughput synthesis and automated histogram analysis technique.ENERGY & ENVIRONMENTAL SCIENCE,13(9),3041-3053.
MLA Deng, Tingting,et al."Discovery of high-performance thermoelectric copper chalcogenide using modified diffusion-couple high-throughput synthesis and automated histogram analysis technique".ENERGY & ENVIRONMENTAL SCIENCE 13.9(2020):3041-3053.
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